High speed wire bonding method

• US 4,340,166 A
• Filed: 05/04/1981
• Issued: 07/20/1982
• Est. Priority Date: 11/22/1978
• Status: Expired due to Term

• Current Assignee: Kulicke & Soffa Investments, Inc.
• Original Assignee: Kulicke and Soffa Industries Incorporated
• Inventors: Rubin, Lawrence M., Vilenski, Dan, Bilane, Glenn B., Soffa, Albert
• Primary Examiner(s): Goldberg, Howard N.
• Assistant Examiner(s): Silverberg, Fred A.
• Application Number:
  US06/260,352
• Time in Patent Office: 442 Days
• Field of Search: 228/4.5, 228/102, 228/179
• US Class Current: 228/180.5
• CPC Class Codes: G05B 19/182 characterised by the machine tool function, e.g. thread cutting, cam making, tool direction control G05B19/21 - G05B19/40 take precedence
• CPC Class Codes: G05B 19/293 with speed feedback only
• CPC Class Codes: G05B 19/401 characterised by control arrangements for measuring, e.g. calibration and initialisation, measuring workpiece for machining purposes G05B19/19 takes precedence
• CPC Class Codes: G05B 2219/43149 Rapid approach, then slow, then pressure for clamping, bonding
• CPC Class Codes: G05B 2219/45033 Wire bonding, wire wrap
• CPC Class Codes: G05B 2219/49142 Shut off power, stop if outside working zone
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/78301 Capillary
• CPC Class Codes: H01L 2224/85205 Ultrasonic bonding
• CPC Class Codes: H01L 24/78 Apparatus for connecting with wire connectors
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01005 Boron [B]
• CPC Class Codes: H01L 2924/01006 Carbon [C]
• CPC Class Codes: H01L 2924/01019 Potassium [K]
• CPC Class Codes: H01L 2924/0103 Zinc [Zn]
• CPC Class Codes: H01L 2924/01033 Arsenic [As]
• CPC Class Codes: H01L 2924/01039 Yttrium [Y]
• CPC Class Codes: H01L 2924/0104 Zirconium [Zr]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]

Abstract

A method for high speed bonding of fine wires to electrodes is provided employing a processor controlled wire bonder wherein the bonding tool of the wire bonder is positioned over an electrode on a simiconductor and is accelerated toward the electrode. Shortly before the bonding tool reaches the electrode, the bonding tool is moved toward the electrode at a substantially linear predetermined velocity so that the bonding tool imparts a controlled kinetic energy to the wire as a first bonding force, a second predetermined preload bonding force is applied to the bonding tool at the time of engagement and subsequently a third and final predetermined bonding force is applied to the bonding tool to bond the fine wire to the electrode at high speeds.

Claims

1. A method for high speed bonding fine wire to a semiconductor device comprising the step of:

moving a bonding tool to a position opposite an electrode on a semiconductor device,

accelerating said bonding tool toward said electrode,

terminating said acceleration of said bonding tool before engaging said semiconductor device,

further moving said bonding tool toward said semiconductor device at a substantially linear velocity,

engaging said semiconductor device with said bonding tool at said linear velocity to impart controlled kinetic energy to said fine wire as a first bonding force,

applying a second predetermined preload bonding force to said first bonding force at the time of engagement of said bonding tool with said semiconductor device, and

applying a third and final bonding force to said bonding tool after the termination of said first bonding force.

2. A method for high speed bonding as set forth in claim 1 wherein said second predetermined preload bonding force is applied through a bonding spring coupled between a tool lifter arm and a bonding tool holder.

3. A method for high speed bonding as set forth in claim 2 wherein said third and final bonding force is applied through said bonding spring, and

overstroking said bonding spring a predetermined amount to provide said third and final bonding force on said bonding tool.