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Integrated circuit carrier package test probe

  • US 4,340,860 A
  • Filed: 05/19/1980
  • Issued: 07/20/1982
  • Est. Priority Date: 05/19/1980
  • Status: Expired due to Term
First Claim
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1. A test probe for facilitating the conductor continuity testing of integrated circuit carrier packages of the type having a cavity for receiving an integrated circuit chip and having conductors extending between exterior contact points disposed along the outside edges of the package and interior contact points disposed within said cavity, comprising:

  • test probe head means including;

    an elastomeric member having at least a portion shaped to matingly penetrate into the chip receiving cavity of said integrated circuit carrier package, the distal surface of said portion forming an outer face; and

    a thin metal foil plate means configured to be approximately co-extensive in size with said outer face and joined thereto, said foil plate means being formed to make simultaneous electrical contact with each interior contact point located within said chip receiving cavity; and

    means for carrying said probe head means so as to position said elastomeric member in aligned relation to and in mating engagement with said chip receiving cavity whereby said foil plate means simultaneously engages and shorts all of said interior contact points together so that continuity testing of each said conductor can be accomplished by contacting pairs of said exterior contact points with a continuity tester.

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