Batch chip placement system
First Claim
1. A batch component placement system for the batch positioning of components at pre-assigned sites upon a substrate where the sites vary in position from substrate to substrate, comprising:
- substrate means having pre-assigned sites including at least one pair of alignment marks thereon;
optical means for locating the actual position of said pair of alignment marks on said substrate means;
means to compare the actual position of said pair of alignment marks with the theoretical position of said marks to determine the amount of misalignment;
a plurality of component locator means, each one of which is arranged to align and locate a component thereon;
means to position components on each of said plurality of component locator means;
means to individually position each of said plurality of component locator means in accordance with said amount of misalignment; and
component pickup means to remove said components from each of said plurality of component locator means and position same at said pre-assigned sites upon said substrate means.
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Accused Products
Abstract
A batch chip placement system for batch positioning semiconductor chips, or the like, upon a substrate containing an array of chip sites or footprints whose actual position on the substrate deviates from the theoretical or nominal position over successive substrates. The positioning is achieved by first sensing the X and Y offsets of a pair of alignment marks on the substrate from their theoretical or nominal position to determine the ΔX and ΔY correction factors required to obtain the actual X,Y position of the alignment marks. The actual X,Y position of the alignment marks is used to determine actual X,Y chip position values, θ rotation and shrinkage factor corrections required to obtain proper orientation and positioning for batch chip placement.
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Citations
33 Claims
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1. A batch component placement system for the batch positioning of components at pre-assigned sites upon a substrate where the sites vary in position from substrate to substrate, comprising:
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substrate means having pre-assigned sites including at least one pair of alignment marks thereon; optical means for locating the actual position of said pair of alignment marks on said substrate means; means to compare the actual position of said pair of alignment marks with the theoretical position of said marks to determine the amount of misalignment; a plurality of component locator means, each one of which is arranged to align and locate a component thereon; means to position components on each of said plurality of component locator means; means to individually position each of said plurality of component locator means in accordance with said amount of misalignment; and component pickup means to remove said components from each of said plurality of component locator means and position same at said pre-assigned sites upon said substrate means. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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13. A batch chip placement system for batch positioning rows of electronic chips to pre-assigned sites upon a substrate where the position of said sites varies from substrate to substrate, comprising:
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substrate means having pre-assigned sites thereon including at least one pair of alignment marks with each of said sites for receiving said chips including an array of electrical contact points; optical alignment means for locating the actual position of said pair of alignment marks on said substrate means; means to compare the said actual position of said pair of alignment marks with the theoretical position of said pair of alignment marks to determine the extent of misalignment in position and orientation between said actual position and said theoretical position of said marks; batch compensator means including a plurality of chip locator means each one of which is arranged to align and locate a chip thereon; means to position chips on each of said plurality of chip locator means; means to position said batch compensator means relative to said substrate means in accordance with the actual position of said pair of alignment marks so that one of said chip locator means is lineally related to the actual position of one of said pre-assigned sites for receiving said chips; means to rotate said batch compensator means about said one of said chip locator means to correct for said misalignment in orientation; and pickup means to remove said chips from each of said plurality of chip locator means and position same at said pre-assigned sites upon said substrate means. - View Dependent Claims (14, 15, 16, 17, 18, 19, 20, 21, 22)
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23. A batch chip placement process for batch positioning rows of electronic chips at pre-assigned sites upon a substrate where the theoretical position of said sites varies form substrate to substrate, comprising the steps of:
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positioning substrate means having said pre-assigned sites thereon including at least one pair of alignment marks within the captive range of optical alignment means; optically scanning said alignment marks to locate the actual position of said pair of alignment marks on said substrate means; comparing the said actual position of said pair of alignment marks with the theoretical position of said pair of alignment marks to determine the extent of misalignment in position and orientation between the said actual position and the said theoretical position of said pair of alignment marks; positioning of row of chips so that each chip is referenced to a known point; moving said row of chips relative to said substrate means in accordance with said extent of misalignment in position so that one of the chips of said row of chips is in a position which is lineally related to the actual position of the corresponding one of said pre-assigned sites; rotating said row of chips about said one of said chips to correct for said misalignment in orientation; and lineally moving said row of chips to position same at said pre-assigned sites upon said substrate means. - View Dependent Claims (24, 25)
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26. A batch component placement system for positioning components at sites on a substrate where the sites vary in position from substrate to substrate, comprising:
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substrate means having sites thereon including component sites; automatic means for locating the position of said sites on said substrate means; a plurality of component locator means positionable with respect to one another; and means to individually position with respect to one another said plurality of component locator means in accordance with the located position of said sites. - View Dependent Claims (27, 28, 29, 30, 31, 32)
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33. A batch component placement method for positioning components at sites on a substrate where said sites vary in position from substrate to substrate, comprising the steps of:
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locating the position of at least two sites on said substrate; individually positioning remote from said substrate each of a plurality of components with respect to one another in an array in accordance with the located position of said sites on said substrate; and moving in a single step said plurality of components to said substrate in the same relative position as they appear in said array.
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Specification