Differential pressure transmitter

• US 4,342,231 A
• Filed: 12/16/1980
• Issued: 08/03/1982
• Est. Priority Date: 12/19/1979
• Status: Expired due to Fees

• Current Assignee: Hitachi, Ltd.
• Original Assignee: Hitachi, Ltd.
• Inventors: Takahashi, Yukio, Nagata, Takeo, Yamamoto, Yoshimi, Matsuoka, Yoshitaka, Shimada, Satoshi, Kasai, Syozo, Yoshida, Tomomasa, Nagasu, Akira
• Primary Examiner(s): WOODIEL, DONALD
• Application Number:
  US06/217,025
• Time in Patent Office: 595 Days
• Field of Search: 73/721, 73/720, 73/727, 73/726, 73/706, 73/708
• US Class Current: 73/721
• CPC Class Codes: G01L 13/025 using diaphragms
• CPC Class Codes: G01L 19/0038 being part of the housing other details about the housing G01L19/14
• CPC Class Codes: G01L 19/0645 using isolation membranes, specially adapted for protection
• CPC Class Codes: G01L 19/142 Multiple part housings
• CPC Class Codes: G01L 19/147 Details about the mounting of the sensor to support or covering means

Abstract

A differential pressure transmitter has a pressure receiving portion and a sensor portion which are constituted from separate parts separably jointed with each other. The sensor portion includes a semiconductor sensor having one side formed with a resistance pattern and the other side which has a thick-walled peripheral portion and a thick-walled central portion. The semiconductor sensor is incorporated in the sensor portion as being supported at the thick-walled peripheral portion thereof. The pressure receiving portion includes seal diaphragms disposed on both sides of the pressure receiving portion and a central diaphragm disposed therein. The semiconductor sensor is arranged such that the side thereof carrying the resistance pattern faces the pressure receiving portion.

Claims

1. A differential pressure transmitter comprising:

a pressure receiving body assembly;

two seal diaphragms disposed at both sides of said pressure receiving body assembly and forming, on both sides of said pressure receiving assembly, pressure receiving chambers for receiving pressures of a high-pressure fluid and a low-pressure fluid, respectively;

a central diaphragm disposed in said pressure receiving body assembly and defining two isolated chambers which communicate with respective one of said pressure receiving chambers;

a semiconductor sensor having a resistance pattern formed on one side thereof and having thick-walled peripheral portion and thick-walled central portion at the other side thereof;

a hollow supporting member attached to the peripheral portion of said other side of said semiconductor sensor; and

a sealing member to which said supporting member is fixed, said sealing member having a first passage for providing a communication, through an internal cavity of said supporting member, between said other side of said semiconductor sensor and one of said pressure receiving chambers, and a second passage providing a communication between said one side of said semiconductor sensor and the other pressure receiving chamber;

said semiconductor sensor being disposed such that the side thereof having said resistance pattern faces said pressure receiving body assembly.

2. A differential pressure transmitter as claimed in claim 1, wherein said sealing member includes a printed circuit board through which an electric signal from said semiconductor sensor is derived and disposed in the vicinity of said semiconductor sensor, and a terminal sealed in a hermetic manner.

3. A differential pressure transmitter as claimed in claim 1, wherein said pressure receiving body assembly includes a first member having a substantially U-shaped cross-section and a second member fitted in said first member.

4. A differential pressure transmitter as claimed in claim 3, wherein said first and second members are bonded to each other by electron beam welding, the depth of weld being 4 mm or greater.

5. A differential pressure transmitter as claimed in claim 3, wherein said central diaphragm is bonded to said first member by electron beam welding.

6. A differential pressure transmitter as claimed in claim 5, wherein the weld width of said electron beam welding is 0.5 to 2 times as large as the thickness of said central diaphragm.

7. A differential pressure transmitter as claimed in claim 3, wherein said second member has a projection for pressing said central diaphragm against said first member.

8. A differential pressure transmitter as claimed in claim 7, wherein said central diaphragm is bonded to said first member by electron beam welding, and said projection presses the portion of said central diaphragm inside of the welded portion.

9. A differential pressure transmitter comprising:

a pressure receiving body assembly;

two seal diaphragms disposed at both sides of said pressure receiving body assembly and forming, on both sides of said pressure receiving body assembly, pressure receiving chambers for receiving pressures of a high-pressure fluid and a low-pressure fluid, respectively,

a central diaphragm disposed in said pressure receiving body assembly and defining two isolated chambers which communicate with respective one of said pressure receiving chambers;

a semiconductor sensor having a resistance pattern formed on one side thereof and having thick-walled peripheral portion and thick-walled central portion at the other side thereof;

a hollow supporting member attached to the peripheral portion of said other side of said semiconductor sensor;

a sealing member to which said supporting member is fixed, said sealing member having a first passage for introducing a first fluid pressure to said other side of said semiconductor sensor through an internal cavity of said supporting member and a second passage for introducing a second fluid pressure to said one side of said semiconductor sensor;

a ceramic substrate disposed in said second conduit adjacent to said semiconductor sensor, said ceramic substrate being adapted to transmit to the outside an electric signal corresponding to the pressure and generated by said semiconductor sensor;

a connector casing portion encasing connectors for electrically connecting said ceramic substrate to the outside so that said electric signal may be delivered to the outside; and

a connecting member having a third passage and a fourth passage through which said first and second passages are communicated with corresponding pressure receiving chambers;

said semiconductor sensor being disposed such that the side thereof having said resistance pattern faces said pressure receiving body assembly.

10. A differential pressure transmitter as claimed in claim 9, wherein said sealing member is covered at its peripheral portion with a metallic member made of a metal having a high corrosion resistance.

11. A differential pressure transmitter as claimed in claim 9, wherein said pressure receiving body assembly has grooves formed in both side surfaces thereof, said grooves being connected to passages providing communications between said pressure receiving chambers and said isolated chambers.