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Interpenetrating dual cure resin compositions

  • US 4,342,793 A
  • Filed: 09/29/1980
  • Issued: 08/03/1982
  • Est. Priority Date: 01/14/1977
  • Status: Expired due to Term
First Claim
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1. A method for forming an interpenetrated urethane linked coating composition on a substrate involving the steps of radiation and thermal curing by:

  • (a) preparing a mixture containing;

    (1) from about 40 percent to about 90 percent by weight of a saturated polyol; and

    (2) from about 10 percent to about 60 percent by weight of a reactive diluent having a radiation sensitive pi bond and a boiling point greater than benzene and mixtures thereof; and

    (3) from about 80 percent to about 120 percent on a hydroxyl-isocyanate equivalent basis of a polyisocyanate;

    (b) applying the mixture to a substrate subjecting the coating so formed to sufficient radiation to polymerize the reactive diluent thereby partially curing the coating; and

    (c) then exposing the partially cured coating of (b) to sufficient thermal energy to form the urethane link,thereby forming the interpenetrated cured coating on the substrate.

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