Interpenetrating dual cure resin compositions
First Claim
1. A method for forming an interpenetrated urethane linked coating composition on a substrate involving the steps of radiation and thermal curing by:
- (a) preparing a mixture containing;
(1) from about 40 percent to about 90 percent by weight of a saturated polyol; and
(2) from about 10 percent to about 60 percent by weight of a reactive diluent having a radiation sensitive pi bond and a boiling point greater than benzene and mixtures thereof; and
(3) from about 80 percent to about 120 percent on a hydroxyl-isocyanate equivalent basis of a polyisocyanate;
(b) applying the mixture to a substrate subjecting the coating so formed to sufficient radiation to polymerize the reactive diluent thereby partially curing the coating; and
(c) then exposing the partially cured coating of (b) to sufficient thermal energy to form the urethane link,thereby forming the interpenetrated cured coating on the substrate.
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Accused Products
Abstract
Curable resin compositions are prepared containing a radiation-sensitive reactive diluent and a saturated polyol. Curing is accomplished by mixing the reactive diluent and the polyol with a polyisocyanate, followed by exposure of the resultant composition to radiation to polymerize the reactive diluent and then, by thermal curing, to form the hydroxyisocyanate (urethane) linkage. The fully cured resin composition is described as interpenetrated or one in which there is no cross-linking between the reactive diluent and urethane linked co-polymer. The interpenetrated resin compositions form tough and hard coatings on various substrates.
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Citations
12 Claims
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1. A method for forming an interpenetrated urethane linked coating composition on a substrate involving the steps of radiation and thermal curing by:
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(a) preparing a mixture containing; (1) from about 40 percent to about 90 percent by weight of a saturated polyol; and (2) from about 10 percent to about 60 percent by weight of a reactive diluent having a radiation sensitive pi bond and a boiling point greater than benzene and mixtures thereof; and (3) from about 80 percent to about 120 percent on a hydroxyl-isocyanate equivalent basis of a polyisocyanate; (b) applying the mixture to a substrate subjecting the coating so formed to sufficient radiation to polymerize the reactive diluent thereby partially curing the coating; and (c) then exposing the partially cured coating of (b) to sufficient thermal energy to form the urethane link, thereby forming the interpenetrated cured coating on the substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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Specification