Capacitive pressure transducer assembly with improved output lead design

• US 4,345,299 A
• Filed: 11/03/1980
• Issued: 08/17/1982
• Est. Priority Date: 11/03/1980
• Status: Expired due to Term

• Current Assignee: Motorola, Inc. (Motorola Solutions, Inc.)
• Original Assignee: Motorola, Inc. (Motorola Solutions, Inc.)
• Inventors: Ho, Roland K.
• Primary Examiner(s): Goldberg, Elliot A.
• Application Number:
  US06/202,988
• Time in Patent Office: 652 Days
• Field of Search: 73/724, 73/718, 361/283, 361/306
• US Class Current: 361/283.4
• CPC Class Codes: G01L 9/0075 using a ceramic diaphragm, e.g. alumina, fused quartz, glass
• CPC Class Codes: H04R 1/04 Structural association of microphone with electric circuitry therefor in deaf-aid sets H04R25/00
• CPC Class Codes: H04R 19/005 using semiconductor materials

Abstract

A ceramic capacitive pressure transducer adaptable for use in automobiles is disclosed. The pressure transducer comprises a relatively thin diaphragm 13 having a capacitive electrode 20 thereon, a base substrate 10 having an opposing electrode 22 thereon, and an annular sealing ring 16 mounting the diaphragm to the base substrate. The base substrate has a peripheral lead bonding area 24 extending laterally beyond the perimeter of the diaphragm with two lead through holes 25, 26 in the bonding area. Metallic output leads 35, 36 are positioned in each of the lead through holes and mechanically and electrically bonded to lead metallizations 27, 28, 30, 31 deposited on the base substrate peripheral portion 24, and one (36) of the output leads is electrically connected to the diaphragm electrode 20 by means of a conductive material 37 inserted through an additional hole 33 in the base substrate located within the perimeter of the diaphragm and in an area of overlap between an outward radial projection 21 of the diaphragm electrode and an inward projection 32 of one (28) of the lead metallizations on the base substrate.

Claims

1. A pressure transducer assembly in which pressure changes displace a diaphragm whose position determines electrical characteristics of the transducer assembly, comprising:

base substrate means having top and bottom substantially planar end surfaces, and having a peripheral portion with a lead bonding area thereon;

flexible diaphragm means, relatively thin with respect to a thicker distance between said top and bottom base substrate end surfaces, having a planar central portion and a surrounding peripheral portion;

mounting means for mounting said peripheral portion of said diaphragm means to said base substrate means top surface, said mounting means, said diaphragm planar central portion and said base substrate top surface generally forming an internal cavity wherein a reference pressure exists, said diaphragm central portion being displaceable with respect to said base substrate top surface in response to sensed pressure changes to thereby alter electrical characteristics of said transducer assembly,

said base substrate means peripheral portion and lead bonding area extending laterally with respect to and beyond the perimeter of said diaphragm means and having, in said lead bonding area, at least one lead through hole from said top to bottom base substrate surfaces for receiving an electrical lead;

said transducer assembly including at least a planar electrode metallization mounted on said diaphragm central portion and having a radial outward projection;

metallization deposited adjacent said lead through hole on of said base substrate means;

an electrical output lead positioned in said through hole and extending to at least said top and bottom base substrate surfaces; and

connection means for electrically connecting said diaphragm electrode to said lead and connecting said lead to said base substrate metallization adjacent said lead through hole,

wherein said adjacent through hole metallization is positioned on said base substrate top surface, and wherein a planar projection of said adjacent through hole metallization extends generally inwardly and overlaps, but is spaced apart from, said diaphragm electrode radial outward projection, and wherein said connecting means comprises means for electrically connecting said adjacent base substrate through hole metallization inward projection and said diaphragm means electrode outward projection in said area of overlap.

2. A pressure transducer assembly according to claim 1 which includes an electrode metallization centrally positioned on said base substrate top surface, said base substrate and diaphragm electrodes effectively forming a capacitor whose capacitance is altered in accordance with the displacement of said diaphragm means in response to sensed pressure changes.

3. A pressure transducer assembly according to claim 1 wherein said mounting means comprises an annular ring positioned on said diaphragm means peripheral portion and said base substrate top surface, and wherein said radial outward projection on said diaphragm means extends beyond said annular ring to permit access of said outward projection by conductive means applied from outside of said internal cavity.

4. A pressure transducer assembly according to claim 3 which includes an additional through hole in said base substrate means positioned in the area of overlap between the base substrate through hole metallization inward projection and the diaphragm electrode radial outward projection, whereby said through hole aids in bonding said base substrate through hole metallization to said diaphragm electrode.

5. A pressure transducer assembly according to claim 4 wherein said connecting means includes conductive epoxy applied through said additional through hole for electrically connecting together said base substrate metallization inward projection and said diaphragm means metallization outward projection.

6. A pressure transducer assembly according to any of claims 1 or 4 wherein said base substrate means also has metallization provided on said bottom surface adjacent said lead through hole and wherein said lead is electrically and mechanically joined to said bottom surface metallization adjacent said through hole.

7. A pressure transducer assembly according to claim 6 wherein said lead is soldered to both said top surface and bottom surface through hole metallizations.

8. A pressure transducer assembly according to claim 2 wherein a second lead out through hole is provided in said base substrate means in said lead bonding area, a second electrical lead is positioned in said second through hole, and wherein metallization is provided on said top surface of said base substrate means adjacent said second through hole, said metallization contacting said second electrode and being electrically and mechanically connected to said metallic lead in said second through hole.

9. A pressure transducer assembly according to claim 8 wherein said base substrate means has metallization provided on both said top and bottom surfaces adjacent each of said lead through holes and wherein each of said leads in said through holes is electrically and mechanically joined to said metallizations adjacent each of said through holes, respectively.

10. A pressure transducer assembly according to any of claims 1, 2 or 9 wherein both said base substrate means and said diaphragm means comprise ceramic substrates.

11. A pressure transducer assembly according to claim 10 wherein said diaphragm means comprises a ceramic disc.

12. A pressure transducer assembly according to claim 11 wherein said base substrate means comprises a generally disc shaped ceramic substrate with portions laterally extending beyond the circumference of said diaphragm means, said base substrate means generally having its top and bottom surfaces configured in a solid horseshoe planar configuration.

13. A pressure transducer assembly in which pressure changes displace a diaphragm whose position determines electrical characteristics of the transducer assembly, comprising:

base substrate means having top and bottom substantially planar end surfaces, and having a peripheral portion with a lead bonding area thereon;

flexible diaphragm means, relatively thin with respect to a thicker distance between said top and bottom base substrate end surfaces, having a planar central portion and a surrounding peripheral portion;

mounting means for mounting said peripheral portion of said diaphragm means to said base substrate means top surface, said mounting means, said diaphragm planar central portion and said base substrate top surface generally forming an internal cavity wherein a reference pressure exists, said diaphragm central portion being displaceable with respect to said base substrate top surface in response to sensed pressure changes to thereby alter electrical characteristics of said transducer assembly;

said base substrate means peripheral portion and lead bonding area extending laterally with respect to and beyond the perimeter of said diaphragm means, and having, in said lead bonding area, at least one metallization on the top surface of said peripheral portion;

said transducer assembly including at least a planar electrode metallization mounted on said diaphragm central portion and having a radial outward projection;

an electrical output lead electrically connected on said peripheral portion to said top surface metallization, wherein a projection of said top surface metallization extends generally inwardly and overlaps, but is spaced apart from, said diaphragm electrode radial outward projection; and

wherein said base substrate means includes a through hole positioned in the area of overlap between the base substrate top surface metallization inward projection and the diaphragm electrode radial outward projection, whereby said through hole aids in bonding said base substrate top surface metallization to said diaphragm electrode; and

connection means for electrically connecting said diaphragm electrode to said base substrate top surface metallization whereby a strong bond between the diaphragm electrode and the base substrate means top surface metallization is provided.

14. A pressure transducer assembly according to claim 13 wherein said connecting means includes conductive means applied through said hole for electrically connecting together said base substrate metallization inward projection and said diaphragm means metallization outward projection.

15. A pressure transducer assembly according to claim 14 wherein said mounting means comprises an annular ring positioned on said diaphragm means peripheral portion and base substrate top surface, and wherein said radial outward projection of said diaphragm means metallization extends beyond said annular ring to permit access of said projection by conductive means applied from outside of said internal cavity.

16. A pressure transducer assembly according to any of claims 13-15 which includes an electrode metallization, in addition to said top surface metallization connected to said diaphragm electrode, centrally positioned on said base substrate top surface, said base substrate and diaphragm electrode metallizations effectively forming a capacitor whose capacitance is altered in accordance to the displacement of said diaphragm means in response to sensed pressure changes.

17. A pressure transducer assembly in which pressure changes displace a diaphragm whose position determines electrical characteristics of the transducer assembly, comprising:

base substrate means having top and bottom substantially planar end surfaces, and having a peripheral portion with a lead bonding area thereon;

flexible diaphragm means, relatively thin with respect to a thicker distance between said top and bottom base substrate end surfaces, having a planar central portion and a surrounding peripheral portion;

mounting means for mounting said peripheral portion of said diaphragm means to said base substrate means top surface, said mounting means, said diaphragm planar central portion and said base substrate top surface generally forming an internal cavity wherein a reference pressure exists, said diaphragm central portion being displaceable with respect to said base substrate top surface in response to sensed pressure changes to thereby alter electrical characteristics of said transducer assembly;

said base substrate means peripheral portion and lead bonding area extending laterally with respect to and beyond the perimeter of said diaphragm means, and having, in said lead bonding area, at least one metallization on the top surface of said peripheral portion;

said transducer assembly including at least a planar electrode metallization mounted on said diaphragm central portion and having a radial outward projection;

an electrical output lead electrically connected on said peripheral portion to said top surface metallization, wherein a planar projection of said top surface metallization extends generally inwardly and overlaps, but is spaced apart from, said diaphragm electrode radial outward projection; and

connection means positioned in the area of overlap between the base substrate top surface metallization inward projection and the diaphragm electrode radial outward projection for electrically connecting said diaphragm electrode to said base substrate top surface metallization in said area of overlap.

18. A pressure transducer assembly according to claim 17 wherein said mounting means comprises an annular ring positioned on said diaphragm means peripheral portion and base substrate top surface, and wherein said radial outward projection of said diaphragm means metallization extends beyond said annular ring to permit access of said projection by conductive means applied from outside of said internal cavity.

19. A pressure transducer assembly according to claim 18 which includes an additional planar electrode metallization, in addition to said base substrate top surface metallization connected to said diaphragm electrode, centrally positioned on said base substrate top surface, said additional base substrate and diaphragm electrode metallizations effectively forming a capacitor whose capacitance is altered in accordance to the displacement of said diaphragm means in response to sensed pressure changes.