Apparatus for mounting electronic components
First Claim
1. An apparatus for mounting electronic components on a substrate comprisinga component feeder having a track along which said electronic components are fed in an aligned row into a position rectifying station,chuck means for grasping and rectifying the position of the electronic components in said position rectifying station, said chuck means having a pair of arm pinching means which are movable relative to one another for defining a receiving recess at said rectifying station, said receiving recess including a receiving face aligned with said component feeder, side pinching faces for engaging the sides of said electronic components to rectify them in an accurate position, and an end wall to terminate feeding of electronic components into the receiving recess,a vertically movable column having a mounting means at the lower end thereof for holding said electronic component by air suction, said mounting means being connected to a suction means,a driving means for driving said chuck means in relation to the vertical movement of said column in a manner that the pinching means is moved so as to form a first gap slightly wider than the width of said electronic component when receiving said electronic component on said receiving face, a second gap equal to the width of said electronic component when rectifying its position and a third gap which is sufficiently wide to allow said column to pass therethrough when placing said electronic component on said substrate.
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Abstract
An apparatus for mounting electronic components on a printed board substrate comprises
a component feeder for sequentially feeding the electronic components in an aligned row,
a chuck which receives and rectifies by pinching the position of the electronic components,
a vertically movable mounting head, which holds by air suction one of the electronic components preliminarily pinched and rectified of the position by the chuck, and goes down through a wide open gap of the chuck to mount the electronic component on an accurate position of the substrate.
75 Citations
6 Claims
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1. An apparatus for mounting electronic components on a substrate comprising
a component feeder having a track along which said electronic components are fed in an aligned row into a position rectifying station, chuck means for grasping and rectifying the position of the electronic components in said position rectifying station, said chuck means having a pair of arm pinching means which are movable relative to one another for defining a receiving recess at said rectifying station, said receiving recess including a receiving face aligned with said component feeder, side pinching faces for engaging the sides of said electronic components to rectify them in an accurate position, and an end wall to terminate feeding of electronic components into the receiving recess, a vertically movable column having a mounting means at the lower end thereof for holding said electronic component by air suction, said mounting means being connected to a suction means, a driving means for driving said chuck means in relation to the vertical movement of said column in a manner that the pinching means is moved so as to form a first gap slightly wider than the width of said electronic component when receiving said electronic component on said receiving face, a second gap equal to the width of said electronic component when rectifying its position and a third gap which is sufficiently wide to allow said column to pass therethrough when placing said electronic component on said substrate.
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2. An apparatus for mounting electronic components in accordance with claim 1, wherein:
said driving means comprises a cam which moves relatively to said column engaging portions of said chuck to drive said pinching means, said cam having first, second and third portions corresponding to said first, second and third gaps, respectively.
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3. An apparatus for mounting electronic components on a substrate comprising
a component feeder having a track along which said electronic components are fed in an aligned row into a position rectifying station, chuck means for grasping and rectifying the position of the electronic components in said position rectifying station, said chuck means having a receiving face to receive said electronic components thereon and a pair of pinching means which are movable relative to one another for pinching the side faces of said electronic components to rectify them in an accurate position, a vertically movable column having a mounting means at the lower end thereof for holding said electronic component by air suction, said mounting means being connected to a suction means, a driving means for driving said chuck means in relation to the vertical movement of said column in a manner that the pinching means is moved so as to form a first gap slightly wider than the width of said electronic component when receiving said electronic component on said receiving face, a second gap equal to the width of said electronic component when rectifying its position and a third gap which is sufficiently wide to allow said column to pass therethrough when placing said electronic component on said substrate, and column rotating means for rotating said column around its axis when moving vertically, said column rotating means comprising a curved cam groove on said column and pin means mounted so as to be slidably engagable with the cam groove.
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4. An apparatus for mounting electronic components on a substrate comprising
a component feeder having a track along which said electronic components are fed in an aligned row into a position rectifying station, chuck means for grasping and rectifying the position of the electronic components in said position rectifying station, said chuck means having a receiving face to receive said electronic components thereon and a pair of pinching means which are movable relative to one another for pinching the side faces of said electronic components to rectify them in an accurate position, a vertically movable column having a mounting means at the lower end thereof for holding said electronic component by air suction, said mounting means being connected to a suction means, a driving means for driving said chuck means in relation to the vertical movement of said column in a manner that the pinching means is moved so as to form a first gap slightly wider than the width of said electronic component when receiving said electronic component on said receiving face, a second gap equal to the width of said electronic component when rectifying its position and a third gap which is sufficiently wide to allow said column to pass therethrough when placing said electronic component on said substrate, and column rotation control means for controlling rotation of said column around its axis when moving vertically, said column rotation control means comprising a linear and vertical cam groove and a curved cam groove positioned on said column, first pin means for slidably engaging said linear and vertical cam groove, second pin means for slidably engaging said curved cam groove and pin control means for selectively actuating engagement of said first or said second pin means with said linear and vertical cam groove or said curved cam groove, respectively.
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5. A device for mounting electronic components on a substrate comprising
a component feeder having a track along which said electronic components are fed in an aligned row, chuck means for sequentially receiving individual electronic components, said chuck means including pivotally mounted pinching means for pinching the sides of said electronic component and rectifying their position, said pinching means including means for defining an electronic component receiving recess having an open end through which electronic components pass from said component feeder, including a receiving face to support the electronic component, a pair of side faces and an end wall against which the electronic component will abut to stop feeding, a vertically movable column having a mounting means at the lower end thereof for holding said electronic component by air suction, said mounting means being connected to a suction means, a driving means for driving said chuck means in relation to the vertical movement of said column in a manner that the pinching means is moved so as to form a first gap slightly wider than the width of said electronic component when receiving said electronic component on said receiving face, a second gap equal to the width of said electronic component when rectifying its position and a third gap which is sufficiently wide to allow said column to pass therethrough when placing said electronic component on said substrate.
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6. A device for mounting electronic components on a substrate comprising
a component feeder having a track which terminates at a discharge point along which said electronic components are fed in an aligned row, chuck means mounted adjacent said discharge point for receiving electronic components from said component feeder and for grasping and rectifying said electronic components, said chuck means including means defining a component receiving recess, said recess means including a receiving surface extending away from said discharge point and terminating at a recess end wall and side walls, said chuck means further including a pair of pinching means which are movable toward and away from one another for engaging the sides of the component when in said recess means to position the components to an accurate position, each of said pinching means including substantially half of said recess means, a vertically movable column having a mounting means at the lower end thereof for holding said electronic component by air suction, said mounting means being connected to a suction means, a driving means for driving said chuck means in relation to the vertical movement of said column in a manner that the pinching means is moved so as to form a first gap slightly wider than the width of said electronic component when receiving said electronic component on said receiving face, a second gap equal to the width of said electronic component when rectifying its position and a third gap which is sufficiently wide to allow said column to pass therethrough when placing said electronic component on said substrate.
Specification