Wire bonding apparatus

• US 4,347,964 A
• Filed: 05/14/1980
• Issued: 09/07/1982
• Est. Priority Date: 05/23/1979
• Status: Expired due to Term

• Current Assignee: Hitachi, Ltd.
• Original Assignee: Hitachi, Ltd.
• Inventors: Kyomasu, Ryuichi, Takasugi, Nobuhiro
• Primary Examiner(s): MCQUADE, JOHN P
• Application Number:
  US06/149,633
• Time in Patent Office: 846 Days
• Field of Search: 228/102, 228/103, 228/4.1, 228/4.5, 228/9, 228/12
• US Class Current: 228/4.5
• CPC Class Codes: H01L 2223/54473 for use after dicing
• CPC Class Codes: H01L 2224/05554 being square
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/45124 Aluminium (Al) as principal constituent
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/49171 Fan-out arrangements
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2224/78 Apparatus for connecting with wire connectors
• CPC Class Codes: H01L 2224/78343 by ultrasonic vibrations
• CPC Class Codes: H01L 2224/78801 Lower part of the bonding apparatus, e.g. XY table
• CPC Class Codes: H01L 2224/83205 Ultrasonic bonding
• CPC Class Codes: H01L 2224/83805 involving forming a eutectic alloy at the bonding interface
• CPC Class Codes: H01L 2224/85121 Active alignment, i.e. by apparatus steering, e.g. optical alignment using marks or sensors
• CPC Class Codes: H01L 2224/85205 Ultrasonic bonding
• CPC Class Codes: H01L 2224/92247 the second connecting process involving a wire connector
• CPC Class Codes: H01L 23/544 Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps test patterns for characterising or monitoring manufacturing processes H01L22/00
• CPC Class Codes: H01L 24/29 of an individual layer connector
• CPC Class Codes: H01L 24/45 of an individual wire connector
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/49 : of a plurality of wire connectors
• CPC Class Codes: H01L 24/85 : using a wire connector wire bonding in general B23K20/004
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00011 : Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/00015 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed as prior art
• CPC Class Codes: H01L 2924/01006 : Carbon [C]
• CPC Class Codes: H01L 2924/01013 : Aluminum [Al]
• CPC Class Codes: H01L 2924/01014 : Silicon [Si]
• CPC Class Codes: H01L 2924/01039 : Yttrium [Y]
• CPC Class Codes: H01L 2924/01074 : Tungsten [W]
• CPC Class Codes: H01L 2924/01075 : Rhenium [Re]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/0132 : Binary Alloys
• CPC Class Codes: H01L 2924/01322 : Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/15153 : the die mounting substrate comprising a recess for hosting the device
• CPC Class Codes: H01L 2924/15165 : Monolayer substrate
• CPC Class Codes: H01L 2924/15787 : Ceramics, e.g. crystalline carbides, nitrides or oxides

Abstract

In a wire bonding apparatus in which, by identifying recognition marks of a pellet or leads displaced from a reference position in wire-bonding a pellet of a semiconductor device to leads within a field of view of a television camera, the displacements of the bonding positions of the pellet and the lead are corrected and then bonding pads on the pellet are connected to the leads by wires, the field of view is moved from a reference view position in a given moving manner, whereby the recognition marks may be identified rapidly and reliably. This apparatus is well adapted for the wire bonding of a semiconductor device of the DILG sealing type, for example, which is poor in the position accuracy of the bonding position.

Claims

1. A wire bonding apparatus for wire bonding a first group of bonding positions disposed on a first member with a second group of associated bonding positions disposed on a second member, one of said first and second members having at least one recognition mark, the apparatus comprising:

a recognition means having a field of view for detecting a presence of the recognition mark in the field of view and for identifying a position of the detected recognition mark in the field of view;

means for successively moving the field of view of said recognition means in a predetermined manner when the recognition mark is not detected until such time the recognition mark falls within the field of view; and

means for computing the positions of said bonding positions based on a detected position of the recognition mark.

2. A wire bonding apparatus according to claim 1, wherein said means for moving the field of view successively moves the field of view to locations which are spaced by a predetermined portion of a size of the field of view.

3. A wire bonding apparatus according to claim 1, wherein said predetermined portion is one-half of a width of the field of view in an x direction and one-half of a width of the field of view in a y direction.

4. A wire bonding apparatus according to claim 1, wherein at least two recognition marks are provided, and wherein the apparatus further includes means for correcting a manner of moving the field of view for enabling a detection of the second recognition mark after a detection of the first recognition mark has been completed in dependence upon a detected result of the first recognition mark.

5. A wire bonding apparatus for automatically wire bonding semiconductor devices loaded on a movable table, the apparatus comprising:

an opto-electrical camera means having a field of view for viewing a recognition mark on a semiconductor device;

a recogntion means for detecting and recognizing a location of an image captured in the field of view of the camera means;

position correction computing means for computing a location of the image in dependence upon a result of recognition supplied from said recognition means; and

control means for judging a result of a computation supplied from the position correction computing means and for at least one of moving the field of view of the camera means to a predetermined position when a recognition mark is not detected in the field of view and controlling the bonding apparatus to achieve a wire bonding.

6. A wire bonding apparatus according to claim 5, wherein said control means moves the field of view successively in a predetermined manner when a recognition mark is not detected in the field of view.

7. A wire bonding apparatus according to claim 6, wherein the semiconductor device includes at least two recognition marks which are disposed at relatively fixed positions, and wherein said control means, after a first of the recognition marks has been detected, is adapted to move the field of view in dependence upon the result of the detection of the first recognition mark.