Plasma etcher having isotropic subchamber with gas outlet for producing uniform etching

• US 4,352,974 A
• Filed: 07/29/1980
• Issued: 10/05/1982
• Est. Priority Date: 08/01/1979
• Status: Expired due to Term

• Current Assignee: Hitachi, Ltd.
• Original Assignee: Hitachi, Ltd.
• Inventors: Komatsu, Hideo, Harada, Kunio, Iida, Shinya, Kanai, Norio, Mizutani, Tatsumi
• Primary Examiner(s): Paschall, M. H.
• Application Number:
  US06/173,364
• Time in Patent Office: 798 Days
• Field of Search: 219/121 PG, 219/121 PD, 219/121 PF, 219/121 PQ, 204/192 E, 204/298, 204/164, 156/643, 156/646, 156/345, 250/530, 250/531, 250/535, 250/539
• US Class Current: 219/121.4
• CPC Class Codes: B23K 10/00 Welding or cutting by means of a plasma
• CPC Class Codes: C30B 33/00 After-treatment of single crystals or homogeneous polycrystalline material with defined structure C30B31/00 takes precedence
• CPC Class Codes: H01J 37/3244 Gas supply means
• CPC Class Codes: H01L 21/3065 Plasma etching; Reactive-ion etching
• CPC Class Codes: H01L 21/32155 Doping polycristalline - or amorphous silicon layers

Abstract

A plasma etcher wherein the provision of a gas outlet directly in an etching chamber is avoided and wherein a subchamber having a sufficient capacity is connected to the etching chamber through a joint part, the gas outlet being provided in this subchamber. With the apparatus, the distribution of etching rates in plasma etching becomes uniform.

Claims

1. In an etcher for etching surfaces of articles with a gaseous discharge plasma generated within an etching chamber provided with a plurality of electrodes, a plasma etcher comprising

(i) an etching chamber containing at least a pair of electrodes, one of said electrodes being arranged to support thereon articles to be etched;

(ii) means defining a gas inlet which serves to introduce a gas directly into said etching chamber;

(iii) means for effecting an isotropic emission of gas from said etching chamber including a joint part forming a restricted passage which is isotropically disposed outside an outer fringe of the electrode for supporting said articles and into and through which said gas can flow from said etching chamber;

(iv) an isotropically-configured subchamber which is coupled with said etching chamber through said joint part and which has a capacity as well as a fluid conductance greater than that of said joint part, said subchamber having an annular configuration and said passage formed by said joint part being restricted to an extent necessary to restrain the gas pressure in said etching chamber in the vicinity of said passage from becoming substantially lower than the gas pressure in other parts of said etching chamber; and

(v) means defining a gas outlet provided in said subchamber for accommodating the outflow of gas.

2. A plasma etcher as defined in claim 1, characterized in that said gas inlet is provided substantially centrally of a top or bottom wall of said etching chamber.

3. A plasma etcher as defined in claim 1, characterized in that said gas inlet is provided in a manner to pass through substantially the center of a top or bottom wall of said etching chamber and to penetrate substantially the center of one of said electrodes.

4. A plasma etcher as defined in claim 1, 2 or 3, characterized in that the ratio between the capacity of said subchamber and the capacity of said etching chamber is at least 0.2.

5. A plasma etcher as defined in claim 4, characterized in that the ratio between the capacity of said subchamber and the capacity of said etching chamber is at least 0.3.

6. A plasma etcher as defined in claim 4, characterized in that the ratio between the sectional area of the part of said subchamber facing said joint part and the sectional area of said joint part is at least 3.

7. A plasma etcher as defined in claim 4, characterized in that the ratio between the sectional area of the part of said subchamber facing said joint part and the sectional area of said joint part is at least 5.

8. A plasma etcher as defined in claim 6, characterized in that said etching chamber has a sidewall of cylindrical shape and said subchamber is isotropically connected to said etching chamber through said sidewall by way of said joint part.

9. A plasma etcher as defined in claim 8, characterized in that said subchamber has an annular configuration and surrounds said etching chamber.

10. A plasma etcher as defined in claim 1, characterized in that said joint part comprises a ring-shaped member having a plurality of holes therein providing communication between said etching chamber and said subchamber.

11. A plasma etcher as defined in claim 10, characterized in that said holes are uniformly spaced around said ring-shaped member.

12. A plasma etcher as defined in claim 1, further including means for connecting an r.f. power source to said electrode for supporting said articles.

13. A plasma etcher as defined in claim 1, further including means for connecting an r.f. power source to the electrode of said pair of electrodes other than the one supporting said articles.

14. A plasma etcher as defined in claim 1, wherein said etching chamber has an axis of symmetry and said gas inlet is disposed on said axis.

15. A plasma etcher as defined in claim 14, wherein said joint part and said subchamber are of annular configuration and are disposed symmetrically with respect to said etching chamber.

16. A plasma etcher as defined in claim 1, characterized in that said etching chamber has a sidewall of cylindrical shape and substantially flat endwalls and said subchamber is isotropically connected to said etching chamber through one of said endwalls by way of said joint part.

17. A plasma etcher as defined in claim 1, characterized in that said etching chamber has a sidewall of cylindrical shape and said subchamber is isotropically connected to said etching chamber through said sidewall by way of said joint part.

18. A plasma etcher as defined in claims 16 or 17, characterized in that the ratio between the sectional area of the part of said subchamber facing said joint part and the sectional area of said joint is at least 3.

19. A plasma etcher as defined in claims 16 or 17, characterized in that said joint part comprises a ring-shaped member having a plurality of holes therein providing communication between said etching chamber and said subchamber.

20. A plasma etcher as defined in claim 19, characterized in that said holes are uniformly spaced around said ring-shaped member.

21. A plasma etcher as defined in claims 16 or 17, characterized in that the ratio between the capacity of said subchamber and the capacity of said etching chamber is at least 0.3.

22. A plasma etcher as defined in claim 1, characterized in that the width of said subchamber in the radial direction and the height thereof are in a ratio no greater than five to one.

23. A plasma etcher as defined in claim 1, characterized in that the width of said subchamber in the radial direction is substantially equal to the height thereof.