Method of forming a mesa in a semiconductor device with subsequent separation into individual devices

• US 4,355,457 A
• Filed: 10/29/1980
• Issued: 10/26/1982
• Est. Priority Date: 10/29/1980
• Status: Expired due to Term

• Current Assignee: Intersil Corporation (Renesas Electronics Corporation)
• Original Assignee: RCA Corporation (General Electric Company)
• Inventors: Dougherty, Daniel J., Barlett, Salvadore P., Lokuta, Frederick P.
• Primary Examiner(s): Rutledge, L. Dewayne
• Assistant Examiner(s): Saba, W. G.
• Application Number:
  US06/201,826
• Time in Patent Office: 727 Days
• Field of Search: 29/578, 29/580, 29/583, 29/413, 29/414, 225/2, 225/96.5, 225/103, 156/644, 156/645, 156/649
• US Class Current: 438/460
• CPC Class Codes: H01L 21/3043 Making grooves, e.g. cutting
• CPC Class Codes: H01L 21/30608 Anisotropic liquid etching H01L21/3063 takes precedence
• CPC Class Codes: H01L 21/78 with subsequent division of the substrate into plural individual devices cutting to change the surface-physical characteristics or shape of semiconductor bodies H01L21/304
• CPC Class Codes: Y10T 225/12 With preliminary weakening
• CPC Class Codes: Y10T 225/325 With means to apply moment of force to weakened work
• CPC Class Codes: Y10T 29/4979 Breaking through weakened portion
• CPC Class Codes: Y10T 29/49792 Dividing through modified portion

Abstract

A method of forming a mesa in a semiconductor device comprises forming a plurality of such devices on a wafer, mechanically cutting relatively wide channels to a predetermined depth in said wafer at positions around individual ones of the devices to partially separate the devices from each other. The mechanical cutting technique defines mesa walls and plain surfaces between individual devices. These channels are then etched to repair scars caused by the cutting technique and, thereafter, the wafer is broken along the center line of the channels to separate the devices from each other.

Claims

1. A method of forming a mesa in a semiconductor device, said method comprising:

forming a plurality of semiconductor devices each having at least one PN junction on a wafer;

mechanically cutting a first set of relatively wide generally U-shaped channels extending in a first direction on opposite sides of each of said devices and cutting a second set of relatively wide generally U-shaped channels extending in a second direction generally perpendicular to the first direction on opposite other sides of each of said devices, said channels having a bottom generally planar surface located below said PN junction and a pair of generally planar mesa walls at which said junctions terminate;

etching said channels for a short time in a dilute etchant to smooth the channel surfaces and to provide a slight arcuate contour to each said mesa wall; and

,

separating said devices from each other by breaking the wafer along the midline of said channels.

2. A method in accordance with claim 1 including the step of scribing the bottom surfaces of each of said channels to define grooves extending along the midlines thereof after etching and then separating said devices along said grooves.

3. A method in accordance with claims 1 or 2 wherein said cutting is done by saw means.

4. A method in accordance with claims 1 or 2 wherein said channels are etched in a dilute solution of boiling sodium hydroxide (NaOH) for a period of about 90 seconds.

5. A method in accordance with claims 1 or 2 wherein said channels are passivated before separating the devices from each other.

6. A method in accordance with claims 1 or 2 wherein said wafer is solder dipped to form terminals thereon before said channels are formed.