Printed circuits
First Claim
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1. An ink for printing of electronic circuits on a substrate comprising:
- a substrate compatible polymer base resin adhesive of a polyester, a polyimide, polyimide-amide, poly-parabanic acid, polycarbonate, polysulfones, polyamine, cellulose triacetate, polyepoxides, or polyurethane, a filler from 0 to about 16%, by weight, based on total solids content of the ink, and from about 5 to about 16%, by weight, based on total solids content of ink, a coordination complex of a metal of a formula LmZXn, wherein L is a ligand or unsaturated organic group, Z is palladium, platinum, nickel or copper metal base of the complex, X is halide, alkyl group, or bidentate ligand and m and n are integers wherein m is from 1 to 4 and n is from 0 to 3, a halogenated alkyl compound of 2 to 4 carbon atoms as a solvent for said ink, said ink having a viscosity of 80 to 2000 cps.
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Abstract
Ink compositions especially suitable for printing electronic circuit patterns on a substrate such as a flexible polyester substrate; methods for developing electrolessly and electrolytically the circuit configurations as articles of manufacture; flexographic printing with the ink composition has been disclosed as the preferred method.
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Citations
12 Claims
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1. An ink for printing of electronic circuits on a substrate comprising:
- a substrate compatible polymer base resin adhesive of a polyester, a polyimide, polyimide-amide, poly-parabanic acid, polycarbonate, polysulfones, polyamine, cellulose triacetate, polyepoxides, or polyurethane, a filler from 0 to about 16%, by weight, based on total solids content of the ink, and from about 5 to about 16%, by weight, based on total solids content of ink, a coordination complex of a metal of a formula LmZXn, wherein L is a ligand or unsaturated organic group, Z is palladium, platinum, nickel or copper metal base of the complex, X is halide, alkyl group, or bidentate ligand and m and n are integers wherein m is from 1 to 4 and n is from 0 to 3, a halogenated alkyl compound of 2 to 4 carbon atoms as a solvent for said ink, said ink having a viscosity of 80 to 2000 cps.
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2. An ink for printing of electronic circuits on a substrate comprising:
- a polyester base resin adhesive, a filler from 0 to about 15%, by weight, based on total solids content of ink, and from about 5 to about 15%, by weight, based on total solids content of ink, of a coordination complex of palladium of a formula LmZXn wherein L is a ligand or unsaturated organic group, Z is palladium, platinum, nickel or copper metal base of the complex, X is a halide, alkyl group, or bidentate ligand and m and n are integers wherein m is from 1 to 4 and n is from 0 to 3, a halogenated alkyl compound, such as of 2 to 4 carbon compounds, as a solvent for the said ink, said ink having a viscosity of 80 to 2000 cps.
- View Dependent Claims (3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
Specification