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Self-aligned, flip-chip focal plane array configuration

  • US 4,369,458 A
  • Filed: 07/01/1980
  • Issued: 01/18/1983
  • Est. Priority Date: 07/01/1980
  • Status: Expired due to Term
First Claim
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1. A flip-chip interconnected focal plane array circuit configuration comprising:

  • a first integrated circuit for signal processing having a first array of electrical signal storage cells, each cell having an injection site and a metallic cell contact disposed at said site to provide electrical connection thereto; and

    a second integrated circuit for radiation detection having a substrate with a first side conditioned for accepting a radiation image thereon, and a second side, opposite said first side, including a second array of metallic detector contacts disposed on the surface thereof, said second array having a greater density of contacts than said first array for substantially equal surface areas, said metallic detector contacts being smaller in physical size than said metallic cell contacts;

    said first and second integrated circuits being interconnected in a flip-chip configuration with each metallic cell contact of said first circuit being bonded physically to a corresponding group of metallic detector contacts of said second circuit, each corresponding bonded group of metallic detector contacts defining a corresponding volume in the substrate of said second integrated circuit and an associated surface area on the first side thereof, whereby in operation, the radiation image accepted by the first side of the second circuit is divided into picture elements in accordance with the defined associated surface areas and electrical signals representative of the radiation image elements are photogenerated in the corresponding volumes of the second circuit, the photogenerated electrical signals being conducted to the correspondingly associated cells of the first circuit, through their metallic cell and detector contact bondings, to form compositely in the storage cell array thereof an electrical representation of the radiation image accepted by the second circuit.

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