Electrically conductive connection of the active portions of an electrical component or of an integrated circuit to terminals

• US 4,371,231 A
• Filed: 09/29/1980
• Issued: 02/01/1983
• Est. Priority Date: 11/12/1979
• Status: Expired due to Term

• Current Assignee: Siemens AG
• Original Assignee: Siemens AG
• Inventors: Jung, Albert
• Primary Examiner(s): McGlynn, Joseph H.
• Application Number:
  US06/192,323
• Time in Patent Office: 855 Days
• Field of Search: 339/17 C, 339/95 R, 339/276 R, 339/275 R, 174/84 C, 174/94 R, 228/44.1 A, 228/115, 228/127, 228/180 A, 228/243
• US Class Current: 439/874
• CPC Class Codes: H01L 2224/04042 Bonding areas specifically adapted for wire connectors, e.g. wirebond pads
• CPC Class Codes: H01L 2224/05556 in side view
• CPC Class Codes: H01L 2224/05624 Aluminium [Al] as principal constituent
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/4807 of bonding interfaces, e.g. interlocking features
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/4845 Details of ball bonds
• CPC Class Codes: H01L 2224/48453 of the interface with the bonding area
• CPC Class Codes: H01L 2224/48463 the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
• CPC Class Codes: H01L 2224/48624 Aluminium (Al) as principal constituent
• CPC Class Codes: H01L 2224/78 Apparatus for connecting with wire connectors
• CPC Class Codes: H01L 2224/85201 Compression bonding
• CPC Class Codes: H01L 2224/85203 Thermocompression bonding
• CPC Class Codes: H01L 2224/85424 Aluminium (Al) as principal constituent
• CPC Class Codes: H01L 23/4824 Pads with extended contours, e.g. grid structure, branch structure, finger structure
• CPC Class Codes: H01L 24/05 of an individual bonding area
• CPC Class Codes: H01L 24/45 of an individual wire connector
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/85 using a wire connector wire bonding in general B23K20/004
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00011 : Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01005 : Boron [B]
• CPC Class Codes: H01L 2924/01006 : Carbon [C]
• CPC Class Codes: H01L 2924/01013 : Aluminum [Al]
• CPC Class Codes: H01L 2924/01041 : Niobium [Nb]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/20752 : larger or equal to 20 microns less than 30 microns

Abstract

An electrically conductive connection is disclosed for the active parts of an electrical component or of an integrated circuit to terminals for external connection. The connection consists of a very thin gold wire and of a metal layer which are situated on the electrical component or on the integrated circuit. The gold wire is connected to the metal layer by means of thermocompression. The metal layer is provided with perforation holes at least in the area of the nailhead of the gold wire formed due to thermocompression, the perforation holes being provided to improve the contact.

Claims

1. An electrically conductive connection of the active part of a semiconductor layer of an electrical component to a terminal for external connection, comprising, a very thin gold wire having one end connected to the external connection terminal;

a metal contact layer having a large group of perforation holes bonded on the semiconductor layer of the electrical component and a contact head at the other end of the gold wire being connected by thermocompression to a portion of the metal layer, the contact head being additionally deformed as a result of deformation into a plurality of said group of perforation holes.

2. The system of claim 1 wherein the contact head comprises an end of the gold wire melted to form a gold ball thermocompressed to the metal layer.

3. An electrical connection system, comprising:

a semiconductor layer having a photolithographed metal connection layer thereon and an external connection terminal;

one end of a gold wire being connected to the external connection terminal;

the other end being connected via an expanded contact head by thermocompression to the metal connection layer at a desired location; and

the metal layer having a large plurality of perforations in a field and a plurality of said perforations lying beneath the contact head at which portions of the contact head are additionally deformed.

4. The system of claim 3 wherein the perforations are rectangular and portions of the contact head are deformed therein.

5. An electrical connection system, comprising:

a surface wave filter formed of a piezo-electric disc having a metal connection strip bonded thereto and an external connection terminal;

one end of a gold wire being connected to the external connection terminal;

the other end being connected via an expanded contact head by thermocompression to the metal connection strip at a desired location; and

the metal connection strip having a large plurality of perforations in a field and a plurality of said perforations lying beneath the contact head at which portions of the contact head are additionally deformed.

6. The system of claim 5 wherein the perforations are rectangular and portions of the contact head are deformed therein.