Method of mounting interrelated components

• US 4,371,912 A
• Filed: 10/01/1980
• Issued: 02/01/1983
• Est. Priority Date: 10/01/1980
• Status: Expired due to Term

• Current Assignee: Motorola, Inc. (Motorola Solutions, Inc.)
• Original Assignee: Motorola, Inc. (Motorola Solutions, Inc.)
• Inventors: Guzik, Andrzej T.
• Primary Examiner(s): Husar, Francis S.
• Assistant Examiner(s): Arbes, Carl J.
• Application Number:
  US06/192,771
• Time in Patent Office: 853 Days
• Field of Search: 29/729, 29/825, 29/832, 29/834, 29/836, 29/840, 174/52 FP, 339/17 B, 339/17 M, 339/17 LM, 357/69, 357/70, 357/75, 361/386, 361/388, 361/395, 361/400, 361/401, 361/403, 361/412, 361/414, 361/417, 361/418, 361/397, 228/179, 228/180 A
• US Class Current: 361/679.31
• CPC Class Codes: H05K 2201/10386 Clip leads; Terminals gripping the edge of a substrate
• CPC Class Codes: H05K 2201/10727 Leadless chip carrier [LCC], e.g. chip-modules for cards
• CPC Class Codes: H05K 2203/0173 Template for holding a PCB having mounted components thereon
• CPC Class Codes: H05K 2203/1484 Simultaneous treatments, e.g. soldering lead-in-hole components simultaneously with surface mounted components
• CPC Class Codes: H05K 2203/1572 Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
• CPC Class Codes: H05K 2203/304 Protecting a component during manufacturing
• CPC Class Codes: H05K 3/3405 Edge mounted components, e.g. terminals
• CPC Class Codes: H05K 3/3415 on both sides of the substrate or combined with lead-in-hole components
• CPC Class Codes: H05K 3/3468 Applying molten solder
• CPC Class Codes: Y02P 70/50 Manufacturing or production processes characterised by the final manufactured product
• CPC Class Codes: Y10T 29/49144 by metal fusion

Abstract

One specially designed fixture allows two components such as a microprocessor and its associated ROM to be simultaneously mounted on opposite surfaces of the substrate, with all or nearly all internal connections made through the area of the substrate between the components. A second fixture allows for wave soldering lead frames to the assembly while protecting the reflow soldered components. The method thus provides the most direct connections between the two components with all internal connections and external connections made by two automatic operations. A third component can be positioned astraddle the mounted assembly for minimum lead lengths.

Claims

1. A double-sided assembly as for electronic apparatus and comprising:

A single insulating substrate having two surfaces with a plurality of conductive paths on each surface and, in at least a central area, a plurality of through-holes with certain of the conductive paths extending through respectives ones of the holes;

a leadless chip carrier smaller in area than the substrate and having conductive areas on a carrier surface, said conductive areas being removably and conductively fused to certain of the conductive paths on one surface of the substrate;

a first electronic component smaller in area than the substrate and having conductive areas on a first component surface, said conductive areas being removably and conductively fused to conductive paths on the other surface of the substrate, said electronic component substantially overlying said leadless chip carrier; and

a plurality of leads, each conductively affixed to a respective one of the conductive paths on opposite surfaces of said substrate and adjacent at least one edge of the substrate.

3. An electronic assembly in accordance with claim 1 or claim 2 wherein, said first electronic component is a second leadless chip carrier.

4. An assembly in accordance with claim 3 wherein, said leadless chip carriers are hermetically sealed.

5. An assembly in accordance with claim 3 wherein, said first leadless chip carrier contains a Read Only Memory and said second leadless chip carrier contains a microprocessor.

6. An assembly in accordance with claim 1 or claim 2 wherein, said conductive areas on the leadless chip carrier and the first electronic component are removably and conductively fused to the conductive paths on the surfaces of the insulating substrate by solder.

7. An assembly in accordance with claim 1 or claim 2 wherein, said leads project normal to the plane of said insulating substrate.

8. An assembly in accordance with claim 1 wherein said leadless chip carrier contains a microprocessor and said first electronic component is a leadless chip carrier containing a Read Only Memory, and said second electronic component is a code plug.

12. A method in accordance with claim 1 wherein each of the conductive paths on a predetermined one of the substrate surfaces continues to a path on the other substrate surface.

2. An assembly as for electronic apparatus and comprising:

a single insulating substrate having two surfaces with a plurality of conductive paths on each surface and, in at least a central area, a plurality of throughholes with certain of the conductive paths extending through respective ones of the holes;

a leadless chip carrier smaller in area than the substrate and having conductive areas on a carrier surface, said conductive areas being removably and conductively fused to certain of the conductive paths on one surface of the substrate;

a first electronic component smaller in area than the substrate and having conductive areas on a first component surface, said conductive areas being removably and conductively fused to conductive paths on the other surface of the substrate, said first electronic component substantially overlying said leadless chip carrier;

a plurality of leads, each conductively affixed to a respective one of the conductive paths on opposite surfaces of said substrate and adjacent at least one edge of the substrate; and

a second electronic component having conductive leads on a least two edges, the second component being position immediately above and conductively coupled to at least one of the leadless chip carrier and first electronic component.

9. A double-sided assembly as for electronic apparatus and comprising;

a single insulating substrate composed primarily of a ceramic material and having two surfaces with a plurality of conductive paths on each surface and, in at least a central area, a plurality of through-holes with certain of the conductive paths extending through respective ones of the through-holes;

a microprocessor packaged inside a first hermetically sealed leadless chip carrier smaller in area than the substrate and having conductive areas on a first chip carrier surface, said conductive areas being soldered to certain of the conductive paths on one surface of the substrate;

a Read Only Memory packaged inside a second hermetically sealed leadless chip carrier smaller in area than the substrate and having conductive areas on a second chip carrier surface, said conductive areas being soldered to conductive paths on the other surface of the substrate, said second chip carrier surface substantially overlying said first chip carrier surface; and

a plurality of leads, each conductively affixed to a respective one of the conductive areas adjacent the edge of said substrate and projecting normal to the plane of said substrate.

10. An assembly as for electronic apparatus and comprising:

a single insulating substrate composed primarily of a ceramic material and having two surfaces with a plurality of conductive paths on each surface and, in at least a central area, a plurality of through-holes with certain of the conductive paths extending through respective ones of the through-holes;

a microprocessor packaged inside a first hermetically sealed leadless chip carrier smaller in area than the substrate and having conductive areas on a first chip carrier surface, said conductive areas being soldered to certain of the conductive paths on one surface of the substrate;

a Read Only Memory packaged inside a second hermetically sealed leadless chip carrier smaller in area than the substrate and having conductive areas on a second chip carrier surface, said conductive areas being soldered to conductive paths on the other surface of the substrate, said second chip carrier surface substantially overlying said first chip carrier surface;

a plurality of leads, each conductively affixed to a respective one of the conductive areas adjacent the edge of the substrate and projecting normal to the plane of said substrate; and

a code plug having conductive leads on at least two edges, said code plug being positioned immediately above and conductively coupled to at least the microprocessor.

11. A method of providing a double-sided assembly as for electronic apparatus including the steps of:

providing an insulating substrate having two surfaces;

providing through-holes in at least the central portion of the substrate;

providing a plurality of conductive paths on each surface of the substrate, including at least some paths on one surface of the substrate which continue through the central holes and onto the other surface of the substrate;

screening solder paste on selected portions of the conductive paths;

providing a first electronic component which is smaller in area than the substrate, and includes conductive paths terminating on a first component surface thereof;

providing a first fixture element having a first cavity for receiving and supporting the first electronic component, and a second cavity above the first cavity for receiving and supporting the substrate;

placing the first electronic component in the first cavity with the first component surface upward;

positioning the substrate in the second cavity;

providing a second electronic component which is smaller in area than the substrate and has conductive paths terminating on a second component surface thereof;

providing a second fixture element having a window therein for receiving the second electronic component;

positioning the second fixture element on the first fixture element;

placing the second electronic component in the window of the second fixture element with second component surface downward, completing a first assembly;

subjecting the completed first assembly to a temperature sufficient to reflow solder the conductive paths of the first and second components to the conductive paths of the substrate;

removing the soldered elements from the fixture;

mechanically attaching at least one lead frame to at least one edge of the substrate and in contact with some of the conductive paths;

providing a third fixture having sections which enclose the portion of the substrate bearing the two electronic components and expose the substrate portion bearing the lead frame;

positioning the reflow soldered assembly in the third fixture element; and

subjecting a portion of the fixture and assembly to flux and molten solder.

13. A method in accordance with claim 11 wherein the component on a predetermined substrate surface is an auxiliary to a primary one of said components, and all conductive paths on the auxiliary component are coupled through central holes to the conductive paths on the primary component.

14. A method in accordance with claim 11 and including the step of providing an insulating layer over at least the conductive areas in the central portions of the substrate before the components are affixed.