Temperature controlled apparatus

• US 4,395,728 A
• Filed: 08/13/1981
• Issued: 07/26/1983
• Est. Priority Date: 08/24/1979
• Status: Expired due to Fees

• Current Assignee: Chou H. Li
• Original Assignee: Chou H. Li
• Inventors: Li, Chou H.
• Primary Examiner(s): James, Andrew J.
• Application Number:
  US06/292,626
• Time in Patent Office: 712 Days
• Field of Search: 357/82, 357/74, 65/32, 165/80, 165/104.26
• US Class Current: 257/715
• CPC Class Codes: H01L 23/427 Cooling by change of state, e.g. use of heat pipes by liquefied gas H01L23/445
• CPC Class Codes: H01L 24/01 Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/12036 PN diode
• CPC Class Codes: H01L 2924/13033 TRIAC - Triode for Alternating Current - A bidirectional switching device containing two thyristor structures with common gate contact
• CPC Class Codes: H01L 2924/13034 Silicon Controlled Rectifier [SCR]

Abstract

A temperature controlled apparatus has a heat-sensitive device chip having its top and bottom major surfaces in direct thermal contact with, respectively, a metal disk and a heat-sinking substrate. A resilient sheet surrounds the chip to form a first gas-tight enclosure between the metal disk and the substrate. A rigid can encloses the assembly and contains an evaporatable liquid to complete the package. When power is applied and dissipated, the chip and metal disk get hot, heating the liquid to increase its vapor pressure, generally logarithmically, inside the can and pressurizing the metal disk. Because of the very large areal ratio between the metal disk and the chip, a pressure is induced on the chip which is greatly magnified, according to the areal ratio, from the vapor pressure.

Claims

1. A temperature-controlled apparatus for cooling, according to demand, a heat-sensitive device having two major surfaces thereon comprising:

a heat-sinking substrate having a substrate contact area of a fixed shape and size on the contact side thereof which is in thermal and physical contact with one of the major surfaces, the thermal resistance through the substrate contact area decreasing with increasing contact pressure between the device and the substrate;

a heat-conductive disk having a disk contact area on one side thereof which is in thermal and physical contact with the other major surface;

a source of an evaporatable liquid in thermal contact with the other side of the disk and whose vapor pressure increases with the temperature of the liquid;

the heat from the device substantially instantaneously heating up the disk through heat conduction across tthe disk contact area to thereby evaporate the liquid and also increase the liquid vapor pressure on the other side of the disk;

a gas-tight and substantially rigid enclosure means enclosing at least the disk and part of the contact side of the substrate to allow the build-up of the vapor pressure of the liquid within the enclosure means;

means for preventing the vapor pressure from being applied to the one side of the disk which is in contact with the device;

the other side of the disk subjected to the liquid vapor pressure thereon being substantially greater than the substrate contact area contacting the device so that to balance the forces on the two sides of the disk the unit contact pressure between the device and the substrate must also be substantially greater than the liquid vapor pressure on the other side of the disk whereby increasing temperature on the device heats up the disk and the liquid to increase the vapor pressure on the other side of the disk and, simultaneously, to increase the contact pressure between the device and the substrate and thus to decrease the thermal resistance thereby allowing more effective heat removal from the device via heat conduction through the substrate at a time when more cooling of the device is needed, without constantly applying unnecessarily high and damaging pressure on the device.

2. The apparatus as in claim 1 wherein the other side of the disk is at least five times greater than the substrate contact area so that the unit contact pressure between the device and the substrate is also at least five times greater than the liquid vapor pressure on the other side of the disk.

3. The apparatus as in claim 2 including a layer of a heat-conductive substance forming a capillary coating covering at least the inner surface of the enclosure means, the other side of the disk, and the contact side of the substrate outside the enclosure means to thereby form a heat pipe design for the operation of the apparatus in more than one orientation.

4. The apparatus as in claim 2 wherein the device has a top and a bottom major surfaces with the one major surface being the bottom major surface and the other major surface being the top major surface, the contact side of the substrate is the top side thereof, and the one and other sides of the disk are respectively the bottom and top sides of the disk.

5. The apparatus as in claim 2 wherein the preventing means comprises a yieldable sheet providing a second gas-tight enclosure around the device but between the disk and the substrate.

6. The apparatus as in claim 2 wherein the heat-sensitive device is a semiconductor chip.

7. The apparatus as in claim 2 wherein the evaporatable liquid is water.

8. The apparatus as in claim 2 wherein the evaporatable liquid is chemically and electrically inert relative to the device.

9. The apparatus as in claim 2 wherein the two major surfaces of the device are smoothened to better than 50 microns to enhance thermal contacts.

10. The apparatus as in claim 2 wherein the contact pressure between the device and the substrate as induced by the liquid vapor pressure exceeds 3.4 atmospheres.