Pattern forming method and pattern forming apparatus using exposures in a liquid

• US 4,396,705 A
• Filed: 09/18/1981
• Issued: 08/02/1983
• Est. Priority Date: 09/19/1980
• Status: Expired due to Term

• Current Assignee: James River Paper Company, Inc. (KOCH Industries Incorporated)
• Original Assignee: Hitachi, Ltd.
• Inventors: Tomita, Yoshifumi, Nonogaki, Saburo, Akeyama, Masamoto
• Primary Examiner(s): Schilling, Richard L.
• Application Number:
  US06/303,400
• Time in Patent Office: 683 Days
• Field of Search: 430/327, 430/396, 430/325, 430/331, 430/403, 430/326, 354/323, 354/333, 355/91, 355/132, 350/63
• US Class Current: 430/326
• CPC Class Codes: G03F 7/2041 in the presence of a fluid, e.g. immersion; using fluid cooling means
• CPC Class Codes: G03F 7/30 Imagewise removal using liquid means
• CPC Class Codes: G03F 7/70866 of mask or workpiece
• CPC Class Codes: H01L 21/30 Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 manufacture of electrodes thereon H01L21/28

Abstract

A pattern forming method comprising a step of disposing a substrate with a coated film of photosensitive composition and a mask having a predetermined pattern in a first liquid which does not dissolve said coated film of photosensitive composition, and a step of exposing said coated film to light through said mask. An apparatus for attaining this method is also disclosed. The influence of dust can be readily avoided and an image with high resolution is obtained.

Claims

1. A pattern forming method comprising a step of disposing a substrate with a coated film of photoresist forming photosensitive composition and a mask having a predetermined pattern in a first liquid which does not dissolve said coated film of photoresist forming photosensitive composition;

a step of exposing said coated film to light through said mask with said coated film and said mask being disposed in said first liquid; and

a step of moving said substrate with said coated film after exposure into a second liquid that is in contact with said first liquid, is not miscible with the first liquid, and has a developing effect to said coated film of photosensitive composition, said substrate being moved into the second liquid to develop said film therein.

2. A pattern forming without method according to claim 1, wherein said first liquid is circulated through a filter to keep said liquid clean.

3. A pattern forming method according to claim 1, wherein said first liquid is kept at a constant temperature.

4. A pattern forming method according to claim 1, further comprising a step of disposing said second liquid in contact with said first liquid.

5. A pattern forming method according to claim 4, wherein said first liquid is circulated through a filter to make said first liquid clean.

6. A pattern forming method according to claim 4, wherein said first liquid is kept at a constant temperature.

7. A pattern forming method according to claim 1 or 4, wherein the specific gravity of said second liquid is smaller than that of said first liquid.

8. A pattern forming method according to claim 1 or 4, wherein the specific gravity of said second liquid is larger than that of said first liquid.

9. A pattern forming method according to claim 1 or 4, wherein said photoresist forming photosensitive composition is a negative working photoresist forming photosensitive composition.

10. A pattern forming method according to claim 9, wherein said first liquid is water.

11. A pattern forming method according to claim 1 or 4, wherein said photoresist forming photosensitive composition is a positive working photoresist forming photosensitive composition.

12. A pattern forming method according to claim 11, wherein said first liquid is selected from the group consisting of trichlorotrifluoroethane, carbon tetrachloride, benzene, and chlorobenzene.

13. A pattern forming method according to claim 1, wherein said substrate is a silicon wafer.

14. A pattern forming method according to claim 1, wherein said second liquid is a solvent for removing the coated film in either the exposed or unexposed regions of the coated film to develop said film.