Fabrication method for high power MOS device
First Claim
1. In a method of fabricating a high power MOS semiconductor device comprising the steps of:
- forming a substantially V-shaped groove in a semiconductor substrate through both a high conductivity region of one conductivity type and a region of opposite type conductivity that surrounds a substantial portion of said high conductivity region of one conductivity type,forming a first insulating layer in said V-shaped groove,forming a doped electrically conductive polysilicon gate electrode layer on the surface of said first insulating layer,forming a second insulating layer on said polysilicon gate electrode layer,forming an opening in said second insulating layer to expose a surface portion of said polysilicon gate electrode layer,depositing electrical contacts to make separate source and drain connections to regions of said semiconductor substrate and to make electrical contact to said polysilicon gate electrode layer through said opening in said second insulating layer, one of said electrical contacts being located on said second insulating layer.
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Abstract
This disclosure relates to a high power VMOS semiconductor device and fabrication method therefor. This VMOS semiconductor device uses a doped polysilicon gate electrode in the V groove and an overlying metal electrode located over an insulation layer protecting the doped polysilicon gate electrode. This overlying metal electrode layer covers substantially the entire surface area (except for a small area where electrical contact is made to the doped polysilicon gate electrode) of one surface of the device. Another embodiment discloses the use of a self-aligned metal contact to the source or drain region of the VMOS device between adjacent V groov
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Citations
10 Claims
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1. In a method of fabricating a high power MOS semiconductor device comprising the steps of:
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forming a substantially V-shaped groove in a semiconductor substrate through both a high conductivity region of one conductivity type and a region of opposite type conductivity that surrounds a substantial portion of said high conductivity region of one conductivity type, forming a first insulating layer in said V-shaped groove, forming a doped electrically conductive polysilicon gate electrode layer on the surface of said first insulating layer, forming a second insulating layer on said polysilicon gate electrode layer, forming an opening in said second insulating layer to expose a surface portion of said polysilicon gate electrode layer, depositing electrical contacts to make separate source and drain connections to regions of said semiconductor substrate and to make electrical contact to said polysilicon gate electrode layer through said opening in said second insulating layer, one of said electrical contacts being located on said second insulating layer. - View Dependent Claims (2, 3, 4)
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5. In a method of fabricating a high power MOS semiconductor device comprising the steps of:
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forming a pair of spaced substantially V-shaped grooves in a semiconductor substrate through both a high conductivity region of one conductivity type and a region of opposite type conductivity that surrounds a substantial portion of said high conductivity region of one conductivity type, forming a first insulating layer in said substantially V-shaped grooves, forming a second insulating layer in said substantially V-shaped grooves, forming a doped electrically conductive polysilicon gate electrode layer on the surface of said second insulating layer in each of said pair of substantially V-shaped grooves, forming a third insulating layer on said polysilicon gate electrode layer, forming an opening in said third insulating layer to expose a surface portion of said polysilicon gate electrode layer, and depositing electrical contacts to make separate source and drain connections to regions of said semiconductor substrate and to make separate electrical contact to said polysilicon gate electrode layer through said opening in said third insulating layer, one of said electrical contacts being located on said third insulating layer. - View Dependent Claims (6, 7, 8, 9, 10)
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Specification