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Polyphenylene ether resin compositions for EMI electromagnetic interference shielding

  • US 4,404,125 A
  • Filed: 10/14/1981
  • Issued: 09/13/1983
  • Est. Priority Date: 10/14/1981
  • Status: Expired due to Term
First Claim
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1. A thermoplastic molding composition which comprises:

  • (a) a polyphenylene ether-styrene resin composition; and

    (b) a conductive material selected from the group consisting of aluminum flakes, a combination of aluminum flakes with carbon fibers or conductive carbon black, a combination of carbon fibers and conductive carbon black, and carbon fibers, in an amount sufficient to render the composition when molded shielding against electromagnetic interference.

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