Polyphenylene ether resin compositions for EMI electromagnetic interference shielding

• US 4,404,125 A
• Filed: 10/14/1981
• Issued: 09/13/1983
• Est. Priority Date: 10/14/1981
• Status: Expired due to Term

• Current Assignee: General Electric Company
• Original Assignee: General Electric Company
• Inventors: Lovgren, Eric M., Abolins, Visvaldis, Bopp, Richard C., Caraher, Joel M.
• Primary Examiner(s): Barr, Josephine
• Application Number:
  US06/311,268
• Time in Patent Office: 699 Days
• Field of Search: 252/511, 252/512, 252/508, 524/441, 524/495, 524/496, 524/508, 525/132, 525/905, 528/485, 528/490, 200/304, 200/305, 335/301
• US Class Current: 252/511
• CPC Class Codes: C08K 3/04 Carbon
• CPC Class Codes: C08K 3/08 Metals
• CPC Class Codes: C08L 2666/04 Macromolecular compounds according to groups C08L7/00 - C08L49/00, or C08L55/00 - C08L57/00; Derivatives thereof
• CPC Class Codes: C08L 71/123 not modified by chemical after-treatment
• CPC Class Codes: H01B 1/22 the conductive material comprising metals or alloys
• CPC Class Codes: H01B 1/24 the conductive material comprising carbon-silicon compounds, carbon or silicon
• CPC Class Codes: H05K 9/0083 comprising electro-conductive non-fibrous particles embedded in an electrically insulating supporting structure, e.g. powder, flakes, whiskers H05K9/0086 takes precedence
• CPC Class Codes: H05K 9/009 comprising electro-conductive fibres, e.g. metal fibres, carbon fibres, metallised textile fibres, electro-conductive mesh, woven, non-woven mat, fleece, cross-linked

Abstract

Compositions or composites comprising a polyphenylene ether-styrene resin blend or composition are disclosed which have electromagnetic shielding properties so that when the compositions are used for electronic equipment components or housings they provide shielding against electromagnetic interference referred to as EMI. The composites eliminate the secondary treatments which have been used heretofore to provide these shielding properties, such as the application of electrically conductive silver, nickel, copper and graphite coatings, or the use of metal screens. The novel compositions of a polyphenylene ether-styrene blend contain as a conductive material, which attenuates the EMI, aluminum flakes, or a combination of aluminum flakes with carbon fibers or with a highly conductive carbon black or a combination of carbon fibers with conductive carbon black, or carbon fibers per se.

Claims

1. A thermoplastic molding composition which comprises:

(a) a polyphenylene ether-styrene resin composition; and

(b) a conductive material selected from the group consisting of aluminum flakes, a combination of aluminum flakes with carbon fibers or conductive carbon black, a combination of carbon fibers and conductive carbon black, and carbon fibers, in an amount sufficient to render the composition when molded shielding against electromagnetic interference.

2. A composition as defined in claim 1 wherein the conductive material is aluminum flakes.

3. A composition as defined in claim 1 wherein the aluminum flakes have an approximate size of 0.040"×

0.050"×

0.001".

4. A composition as defined in claim 1 wherein the conductive material is a combination of aluminum flakes with carbon fibers.

5. A composition as defined in claim 1 wherein the conductive material is a combination of aluminum flakes and conductive carbon black.

6. A composition as defined in claim 1 wherein the conductive material is a combination of carbon fibers and conductive carbon black.

7. A composition as defined in claim 1 wherein the conductive material is carbon fibers.

8. A composition as defined in claim 1 wherein the polyphenylene ether resin includes structural units of the formula:

##STR2## wherein Q, Q'"'"', Q" and Q"'"'"' are independently selected from the group consisting of hydrogen, hydrocarbon radicals, halohydrocarbon radicals having at least two carbon atoms between the halogen atom and the phenyl nucleus, hydrocarbonoxy radicals and halohydrocarbonoxy having at least two carbon atoms between the halogen atom and the phenyl nucleus, and Q'"'"', Q" and Q"'"'"' in addition may be halogen with the proviso that Q and Q'"'"' are both free of a tertiary carbon atom; and

n represents the total number of monomer residues and is an integer of at least 50.

9. A composition as defined in claim 8 wherein the polyphenylene ether resin is poly(2,6-dimethyl-1,4-phenylene)ether.

10. A composition as defined in claim 1 where the styrene resin is a polystyrene.

11. A composition as defined in claim 1 wherein the styrene resin is a high impact polystyrene.

12. A composition as defined in claim 1 wherein the polyphenylene ether resin is poly(2,6-dimethyl-1,4-phenylene)ether, the styrene resin is a polystyrene and the conductive material is aluminum flakes.

13. A composition as defined in claim 12 wherein the aluminum flakes have an approximate size of 0.040"×

0.050"×

0.001".

14. A composition as defined in claim 1 wherein the polyphenylene ether resin is poly(2,6-dimethyl-1,4-phenylene)ether, the styrene resin is a polystyrene, and the conductive material is a combination of aluminum flakes with carbon fibers.

15. A composition as defined in claim 1 wherein the polyphenylene ether resin is poly(2,6-dimethyl-1,4-phenylene)ether, the styrene resin is a polystyrene, and the conductive material is a combination of aluminum flakes with conductive carbon black.

16. The compositions as defined in claims 12, 13, 14 or 15 wherein the styrene resin is a high impact polystyrene resin.

17. The composition as defined in claim 1 which comprises 100 parts by weight of the polyphenylene ether-styrene resin composition and from about 5 parts to about 250 parts by weight of the conductive material.

18. A molded composition obtained by injection or compression molding the composition of claim 1.

19. An electronic equipment component exhibiting electromagnetic shielding, manufactured from the composition described in claim 1.

20. A housing for electric/electronic equipment subject to electromagnetic interference, manufactured from the composition described in claim 1.