Method for manufacturing a module for a fiber optic link

• US 4,410,469 A
• Filed: 11/27/1981
• Issued: 10/18/1983
• Est. Priority Date: 11/28/1980
• Status: Expired due to Term

• Current Assignee: Tokyo Shibaura Denki Kabushiki Kaisha (Toshiba Corporation)
• Original Assignee: Tokyo Shibaura Denki Kabushiki Kaisha (Toshiba Corporation)
• Inventors: Ohashi, Makoto, Donuma, Kenichi, Katagiri, Shuhei
• Primary Examiner(s): LOWE, JAMES
• Application Number:
  US06/325,486
• Time in Patent Office: 690 Days
• Field of Search: 264/1.5, 264/272.17, 264/272.16, 264/272.15, 29/588, 29/569 L, 350/96.17, 350/96.20, 350/96.18, 357/72
• US Class Current: 264/1.25
• CPC Class Codes: G02B 6/4292 the light guide being disconnectable from the opto-electronic element, e.g. mutually self aligning arrangements
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48257 connecting the wire to a die pad of the item
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01019 Potassium [K]
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/12041 LED
• CPC Class Codes: H01L 2924/3025 Electromagnetic shielding
• CPC Class Codes: H01L 33/483 Containers
• CPC Class Codes: Y10S 359/90 Methods

Abstract

In a method for manufacturing a module for a fiber optic link, a plate-shaped transparent circuit unit is molded in advance. The circuit module is transfer molded together with an optoelectronic element connected to leads. The circuit module is clamped between a pair of rod-shaped first dies which have a common central axis and one of which defines an optical path of the module, in such a manner that the optoelectronic element is located on a central axis of the circuit module. Under this condition, the circuit module is housed in a cavity defined by a pair of second dies. A light-shielding molding material is injected into the cavity for injection molding to mold a case. After the case is cured, the first and second dies are removed, and the hole of the case formed by one of the first die is closed with a cap to complete a receptacle.

Claims

1. A method for manufacturing a module for a fiber optic link comprising the steps of:

(a) transfer molding a transparent first member having a predetermined shape and an optoelectric element embedded therein, said optoelectric element being mounted on one of a plurality of leads extending outwardly from said first member;

3. A method according to claim 1, wherein step (c) is practiced by embedding a portion of said first member in said second member.

4. A method according to claim 1, wherein during practice of step (b), said first dies define a cavity conforming to an outer shape of said first member, said first member being housed in said cavity when said first member is clamped;

and, wherein during practice of step (c), a portion of said leads extending outwardly from said first member is embedded in said second member so that said first member is fixed to said second member.

5. A method according to claim 1, wherein step (b) is practiced by arranging a spacer between one of said first dies and said first member, and said first member is clamped between said first die through said spacer.

6. A method according to claim 4, wherein during practice of step (b), said first dies define a cavity conforming to an outer shape of said first member with said spacer, and said first member and said spacer are housed in said cavity when said first member and said spacer are clamped;

and wherein during practice of step (c), a portion of said leads extending outwardly from said first member is embedded in said second member, so that said first member is fixed to said second member.

7. A method according to claim 1, wherein said first member has a convex lens segment formed on an optical axis of said optoelectric element.

8. A method according to claim 1, wherein said second member has a socket to which is mounted a fiber cable connector and which has a hole formed by one of said first dies and defining the optical path of the module.

9. A method according to claim 1, wherein an inner diameter of said hole is substantially equal to an outer diameter of a plug of said fiber cable connector.

10. A method according to claim 6 wherein said one of said first dies includes means defining a coaxially disposed, concave recessed surface, and wherein step (b) is practiced by mating said convex lens with said concave recessed surface, said lens segment thereby being coaxially disposed relative said first pair of dies.

2. (b) clamping said first member between a pair of coaxially opposing, reciprocably movable first rod-shaped dies, one of said first dies defining an optical path in the module while simultaneously positioning said optoelectric element coaxially with respect to said pair of rod-shaped dies and said optical path;

(c) injection molding a second member by positioning said first member clamped by said first dies in accordance with step (b) in a cavity defined by a pair of second dies conforming to a predetermined shape of said second member, and injecting a light-shielding molding material into said cavity;

(d) removing said first and second pairs of dies; and

(e) covering, with a cap, a hole defined in said member, said hole being formed by the other of said first dies after step (d) is practiced.

11. A method of manufacturing a module for a fiber optic link using a pair of first dies each having opposing end portions, said first pair of dies reciprocably and coaxially movable relative to one another, and a pair of second dies defining a cavity, said second pair of dies transversely positioned with respect to said pair of first dies and reciprocably movable to clamp said first pair of dies so that said end portions are within said cavity, said method comprising the steps of:

(a) transfer molding a transparent first member having a predetermined shape and an optoelectric element embedded therein, said optoelectric element being operatively coupled to one of a plurality of leads outwardly extending from said first member,

(b) coaxially positioning said optoelectric element between said pair of opposing first dies,

(c) clamping said first member between said end portions of said pair of first dies after said optoelectric element is coaxially positioned according to step (b),

(d) positioning said first member clamped according to step (c) in said cavity and injecting a light-shielding molding material into said cavity,

(e) removing said first and second dies, one of said first dies after removal defining an optical path in said module, said optical path being coaxially aligned with said optoelectric element, the other of said first dies after removal defining an aperture in said module, said aperture coaxially opposing said optical path, and

(f) covering said aperture with a light-shielding cap,

whereby

said optoelectric element is coaxially positioned with respect to said optical path and whereby simultaneous optical alignment and molding of said module is effected by virtue of said clamping relationship of said first member between said pair of first dies.

12. A method of manufacturing a module for a fiber optic link using a first pair of coaxially opposing dies each reciprocably movable with respect to one another and having opposing end portions, one of said dies of said first pair at the respective end portion including means defining a recessed surface coaxially disposed with respect to said first pair, and a second pair of dies defining a cavity and transversely positioned with respect to said first pair of dies, said second pair being reciprocably movable to clamp said first pair of dies so that said end portions are within said cavity, said method comprising the steps of:

(a) transfer molding a transparent first member having a convex lens in optical alignment with an optoelectric element embedded therein, said optoelectric element being operatively coupled to one of a plurality of leads outwardly extending from said first member,

(b) coaxially positioning said optoelectric element between said first pair of opposing dies by matingly positioning said convex lens in said recessed surface defining means,

(c) clamping said first member between said end portions of said first pair of dies after said optoelectric element is coaxially positioned according to step (b),

(d) positioning said first member clamped according to step (c) in said cavity and injecting a light-shielding molding material into said cavity,

(e) removing said first and second pairs of dies, one die of said first pair after removal defining an optical path in said module, said optical path being coaxially aligned with said optoelectric element, the other die of said first pair after removal defining an aperture in said module, said aperture coaxially opposing said optical path, and

(f) covering said aperture with a light-shielding cap,

whereby

said optoelectric element is coaxially positioned with respect to said optical path and whereby simultaneous optical alignment and molding of said module is effected by virtue of said clamping relationship of said first member between said first pair of dies.