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First wall and limiter surfaces for plasma devices

  • US 4,414,176 A
  • Filed: 06/01/1981
  • Issued: 11/08/1983
  • Est. Priority Date: 06/01/1981
  • Status: Expired due to Fees
First Claim
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1. In a plasma device, a metallic member exhibiting reduced erosion when exposed to plasma at an elevated temperature, the member comprising:

  • a metallic substrate composed of a first metal and a protective thin surface layer on the substrate, the surface layer comprising at least about 90 atomic percent of a second metal selected from the group consisting of alkali and alkaline earth metals, the first metal being more electronegative than the second metal, the surface layer being characterized by atoms of the second metal having ionic bonds to atoms of the first metal in the substrate and forming a higher ratio of secondary ions to neutrals than atoms of the second metal in bulk form when exposed to said plasma, and the binding energy between atoms of the first and second metal being below the binding energy between like atoms of the first metal and above the binding energy between like atoms of the second metal.

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