Method of batch-fabricating flip-chip bonded dual integrated circuit arrays
First Claim
1. A method of batch-fabricating a plurality of high-density flip-chip bonded dual integrated circuit arrays comprising the steps of:
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Abstract
A focal plane array including a first integrated circuit for infrared radiation (IR) detection and a second integrated circuit for signal processing is assembled in a flip-chip structural configuration. Each integrated circuit includes an array of metallic contacts on a surface thereof for interconnection in the flip-chip arrangement. The contact array of the IR detector includes a substantially greater number of contacts than the contact array of the signal processor. Consequently, it is not a prerequisite to precisely align the two integrated circuits in a one-to-one contact relationship for the flip-chip bonding operation therebetween. Thus, each metallic contact of the signal processor may be roughly aligned and bonded to a corresponding group of metallic contacts of the IR detector array without altering significantly the operation of the overall focal plane array as long as at least one metallic contact of the IR detector array is included in each corresponding contact group. As a result of this structural improvement, a method of batch-fabricating a plurality of high-density focal plane arrays may be accomplished quite expeditiously.
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Citations
9 Claims
- 1. A method of batch-fabricating a plurality of high-density flip-chip bonded dual integrated circuit arrays comprising the steps of:
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2. fabricating a first integrated circuit for signal processing having a first array of electrical signal storage cells with an injection region and a metallic cell contact disposed at each cell;
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fabricating a second integrated circuit for radiation detection having a substrate with a first side conditioned for accepting a radiation image thereon, and a second side, opposite said first side, including a second array of metallic detector contacts disposed on the surface thereof, said second array being fabricated with a greater density of contacts than said first array for substantially equal surface areas, each metallic detector contact being fabricated of a physical size which is smaller than said metallic cell contacts; bonding each metallic cell contact of said first integrated circuit to a corresponding group of metallic detector contacts of said second integrated circuit to render a dual integrated circuit flip-chip configuration; and dividing the bonded dual integrated circuit flip-chip configuration into a plurality of high-density dual integrated circuit flip-chip bonded predetermined arrays.
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Specification