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Method of batch-fabricating flip-chip bonded dual integrated circuit arrays

  • US 4,416,054 A
  • Filed: 09/29/1982
  • Issued: 11/22/1983
  • Est. Priority Date: 07/01/1980
  • Status: Expired due to Term
First Claim
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1. A method of batch-fabricating a plurality of high-density flip-chip bonded dual integrated circuit arrays comprising the steps of:

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