Identification card with IC chip and a method for manufacturing the same

• US 4,417,413 A
• Filed: 11/29/1982
• Issued: 11/29/1983
• Est. Priority Date: 05/17/1979
• Status: Expired due to Term

• Current Assignee: GAO Gesellschaft Fur Automation und Organisation mbH
• Original Assignee: GAO Gesellschaft Fur Automation und Organisation mbH
• Inventors: Hoppe, Joachim, Haghiri-Tehrani, Yahya
• Primary Examiner(s): Swiatek, Robert P.
• Assistant Examiner(s): Foycik, Michael J.
• Application Number:
  US06/444,964
• Time in Patent Office: 365 Days
• Field of Search: 40/625, 40/626, 40/627, 40/628, 40/629, 40/630, 40/631, 283/74, 283/75, 283/76, 283/77, 283/78, 283/82, 283/83, 283/84, 283/107, 283/108, 283/109, 283/110, 283/111, 283/112, 235/487, 235/488, 235/441-443, 235/492, 307/303
• US Class Current: 40/630
• CPC Class Codes: G06K 19/07745 Mounting details of integrated circuit chips
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: Y10S 283/904 Credit card
• CPC Class Codes: Y10T 29/4913 Assembling to base an electrical component, e.g., capacitor, etc.
• CPC Class Codes: Y10T 29/49144 by metal fusion

Abstract

An identification card incorporating an integrated circuit (IC) chip for processing electric signals incorporates a separate supporting element for the IC chip. The supporting element is mounted in a window of one corner of the identification card to avoid the principal axis of stress. The chip supporting element and the window are of the same general shape. However, the window is larger than the supporting element to provide a clearance area surrounding the supporting element. Resilient cover sheets are adhesively mounted to the identification card to fix the position of the supporting element within the window and maintain the clearance area surrounding the supporting element. The top cover sheet has a recess which is aligned with a portion of the supporting element to allow access to contacts mounted on that portion of the supporting element to provide electrical connections with the IC chip.

Claims

1. An identification card comprising a flexible substrate;

an IC module for the processing of electrical signals;

a separate carrier element to which said IC module is attached;

contact surfaces located on said carrier element for engaging electrodes exteriorly disposed of said card;

leads interconnecting said IC module and said contact surfaces;

said substrate having a window for reception of said carrier element;

said carrier element being substantially as thick as said identification card and completely surrounding said IC module;

said window being slightly larger than said carrier element whereby a gap surrounds the periphery of said carrier element;

resilient means for supporting said carrier element in said window and bridging such gap;

said resilient means effecting bonds supporting said carrier element in said window which bonds remain unbroken during flexing of said card in the normal course of card use;

said carrier element having greater resistance to bending than said card portions surrounding said carrier element, whereby said carrier element may extend beyond a surface of said card when the card portions surrounding said carrier element are flexed into a nonplanar configuration.

2. The identification card according to claim 1 in combination with flexible cover sheets defining opposed faces of said identification card and which comprise the resilient supporting means;

said cover sheets being so flexible and said window being of such size relative to said carrier element therein that card portions adjacent to said window may bend without wedging said carrier element therebetween.

3. The identification card according to claim 2 wherein one of said cover sheets is apertured in the region of the contact surfaces whereby said contact surfaces are exposed on a card surface.

4. The identification card according to claim 2, wherein said cover sheets are adhesively secured to said card substrate and said carrier element, and the carrier element is held in position only by said cover sheets.

5. The identification card according to claim 2, wherein said cover sheets are provided with a printed pattern which covers the gap between the carrier element and the card substrate.

6. The identification card according to claim 1 wherein the carrier element comprises a box-shaped structure supportably engaging said IC module, said leads and said contact surfaces.

7. The identification card according to claim 6 wherein said contact surfaces provided on at least one surface of the carrier element are electically connected to the IC module by means of said leads which extend through a wall of said carrier element.

8. The identification card according to claim 6 wherein the IC module is resiliently mounted within the carrier element.

9. The identification card according to claim 6 wherein the carrier element is circular in cross-section.

10. The identification card according to claim 1 wherein the carrier element and the window in the identification card are provided with positioning aids for desired location of said carrier element in said window.

11. A method for the manufacture of identification cards, each of said cards having an IC module enclosed within a carrier element which is in turn resiliently mounted in an opening disposed in a body portion of the identification card;

said carrier element having contact areas mounted on at least one of its surfaces which areas are substantially flush with the outer surface of said card;

the steps comprising forming openings in a card sheet from which identification card body portions are to be formed;

laminating a cover sheet to said card sheet and punching out contact openings in said cover sheet for access to said contact areas;

inserting the carrier elements in said openings in said card sheet from which said card body portions are to be formed, and locating said carrier elements in said openings so that said carrier elements are spaced from the peripheries of the openings in said card sheet; and

interfitting said contact areas of the carrier elements in said cover sheet openings;

laminating a second cover sheet to said card sheet whereby each carrier element is resiliently mounted in an opening in the resulting card-cover sheet assembly between opposed cover sheets; and

forming individual identification cards from such assembly.