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Strain relief technique for surface acoustic wave devices

  • US 4,422,055 A
  • Filed: 10/30/1981
  • Issued: 12/20/1983
  • Est. Priority Date: 10/30/1981
  • Status: Expired due to Fees
First Claim
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1. A surface acoustic wave (SAW) device, comprising:

  • an elastic SAW substrate having a surface with at least one strain sensitive surface area;

    a cover bonded to the elastic SAW substrate to form a chamber above at least a portion of one of the strain sensitive surface areas of the elastic SAW substrate;

    a cut extending into the elastic SAW substrate and surrounding a selected surface region of the portion of the strain sensitive surface area which is within the chamber formed by the cover, said cut having a width and a depth sufficient to isolate the selected surface region from surface strains originating outside the selected surface region;

    at least one acousto-electric coupling means disposed on the isolated surface region; and

    connector means for electrically connecting each acousto-electric coupling means to electronic circuitry.

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