Conformal coating systems

• US 4,424,252 A
• Filed: 11/12/1982
• Issued: 01/03/1984
• Est. Priority Date: 11/12/1982
• Status: Expired due to Term

• Current Assignee: Loctite Corporation (Henkel AG & Co KGaA)
• Original Assignee: Loctite Corporation (Henkel AG & Co KGaA)
• Inventors: Nativi, Larry A.
• Primary Examiner(s): Newsome, John H.
• Application Number:
  US06/441,117
• Time in Patent Office: 417 Days
• Field of Search: 427/54.1, 427/44, 204/159.16, 204/159.19, 428/209, 428/901
• US Class Current: 428/209
• CPC Class Codes: B05D 3/06 by exposure to radiation B05D3/02 takes precedence ; plasma treatment B05D3/141
• CPC Class Codes: C08F 220/00 Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
• CPC Class Codes: C08F 299/065 from polyurethanes with side or terminal unsaturations
• CPC Class Codes: C08G 18/10 Prepolymer processes involving reaction of isocyanates or isothiocyanates with compounds having active hydrogen in a first reaction step
• CPC Class Codes: C08G 18/42 Polycondensates having carboxylic or carbonic ester groups in the main chain
• CPC Class Codes: C08G 18/672 Esters of acrylic or alkyl acrylic acid having only one group containing active hydrogen
• CPC Class Codes: C08G 18/8006 with compounds of C08G18/32
• CPC Class Codes: C09D 4/00 Coating compositions, e.g. paints, varnishes or lacquers, based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; Coating compositions, based on monomers of macromolecular compounds of groups C09D183/00 - C09D183/16
• CPC Class Codes: H05K 2201/09872 Insulating conformal coating
• CPC Class Codes: H05K 3/287 Photosensitive compositions
• CPC Class Codes: Y10S 428/901 Printed circuit
• CPC Class Codes: Y10T 428/24917 including metal layer

Abstract

Ultraviolet curable polymerizable coating system having one or more built-in secondary curing mechanisms is disclosed. The polymerizable coating system is a two component system comprising (1) a first component comprising at least one urethane-acrylate or methacrylate, and a mono or polyfunctional acrylate or methacrylate diluent and a polymerization initiator of the photo-initiator type, and (2) a second component comprising a polyisocyanate. The coating system is uv curable, and also possess at least one additional cure mechanism.

Claims

1. A two-part coating composition, especially useful for conformal coating, comprising:

(1) a first part comprising at least one urethane-acrylate or urethane-methacrylate compound, a mono or polyfunctional acrylate or methacrylate reactive diluent and a polymerization initiator of the photoinitiator type; and

(2) a second part comprising a polyisocyanate containing adduct,

at least one component of said first part containing unreacted hydroxyl groups, said composition having an equivalent weight excess of isocyanate groups in said second part to the hydroxyl groups in said first part of at least 2;

1.

2. The coating composition of claim 1, wherein said urethane-acrylate or urethane methacrylate compound comprises a polyester-urethane-acrylate or a polyester urethane methacrylate.

3. The coating composition of claim 2, wherein the polyester portion of said polyester-urethane-methacrylate comprises a polyester diol.

4. The coating composition of claim 3, wherein said polyester diol comprises the reaction product of neopentyl glycol and 1,6-hexanediol with adipic acid.

5. The coating composition of claim 1, and further comprising a non-ionic surfactant.

6. The coating composition of claim 5, wherein said non-ionic surfactant contains pendant free hydroxyl groups.

7. The coating composition of claim 6, wherein said non-ionic surfactant comprises a polyoxyalkene silicone.

8. The coating composition of claim 1, wherein said acrylate or methacrylate reactive diluent contains at least one reactive allylic bond.

9. The coating composition of claim 1, wherein said reactive diluent comprises from about 30% to about 70% by weight of said first part.

10. The coating composition of claim 1 wherein said polyisocyanate is present in equivalent weight excess in the range of about 2:

1 to about 10;

1.

11. The coating composition of claim 1 wherein said polyisocyanate is present in equivalent weight range excess in the range of about 5:

1 to about 7;

1.

12. The coating composition of claim 10 wherein said polyisocyanate is present in equivalent weight excess of about 6:

1.

15. A printed circuit board having one or more components mounted thereon, and covered at least in part with the cured coating composition of claim 1.

13. A method of forming a UV curing polymerizable conformal coating on a substrate wherein said substrate has one or more shadow areas, comprising the steps in sequence of:

(1) providing a two-part coating composition, the first part of which comprises at least one urethane-acrylate or urethane-methacrylate compound, a mono or polyfunctional acrylate or methacrylate reactive diluent and a polymerization initiator of the photo-initiator part, and a second part which comprises a polyisocyanate containing adduct at least one component of said first part containing unreacted hydroxyl groups, said composition having an equivalent weight excess of isocyanate groups in said second part to the hydroxyl groups in said first part of at least 2;

1;

(2) blending said first and second parts to form a coating composition;

(3) applying said coating composition to said substrate;

(4) exposing the coated substrate to UV light wave length and intensity to effect UV cure of exposed areas of said coating; and

(5) storing said coated substrate under conditions of temperature and humidity such as to promote curing of unexposed (shadow) areas of said coating through a built-in secondary moisture cure mechanism.

14. A method according to claim 13, wherein said substrate comprises a circuit board, and wherein said circuit board has one or more components mounted thereon overshadowing areas of said circuit board.