Thin film thermistor
First Claim
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1. A thin film thermistor comprising:
- an insulating substrate having two surfaces;
one pair of electroconductive electrode films arranged on one surface of said insulating substrate in a desired pattern, the electrodes being electrically insulated from each other;
a thermally sensitive resistive film arranged on said one surface of said insulating substrate and said at least one pair of electroconductive electrode films, said film arranged so as to leave part of said electrodes exposed for making external connections thereto;
one pair of external leads connected to said exposed electrode portions; and
a metal housing in a cylindrical form having a bore extending along the longitudinal axis thereof and having both a closed end and an open end, wherein another surface of said insulating substrate is secured to the inner surface of said closed end by a brazing arrangement of an Ag-Cu alloy layer, one of a Ti and a Zr foil layer, and another Ag-Cu alloy layer, said layers arranged between said another surface of said insulating substrate and said inner surface of said closed end.
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Abstract
A thin film thermistor having a thermistor element, one pair of external leads and a metal housing is arranged such that the thermistor element is secured to the inner surface thereof by brazing. The thin film thermistor rapidly detects temperatures by means of a mechanical connection between the thermistor and an outer surface of an object that it touches. The thermistor element may be covered with a protective layer of a fired low melting point glass in order to protect the thermistor element from a severe environment.
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Citations
13 Claims
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1. A thin film thermistor comprising:
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an insulating substrate having two surfaces; one pair of electroconductive electrode films arranged on one surface of said insulating substrate in a desired pattern, the electrodes being electrically insulated from each other; a thermally sensitive resistive film arranged on said one surface of said insulating substrate and said at least one pair of electroconductive electrode films, said film arranged so as to leave part of said electrodes exposed for making external connections thereto; one pair of external leads connected to said exposed electrode portions; and a metal housing in a cylindrical form having a bore extending along the longitudinal axis thereof and having both a closed end and an open end, wherein another surface of said insulating substrate is secured to the inner surface of said closed end by a brazing arrangement of an Ag-Cu alloy layer, one of a Ti and a Zr foil layer, and another Ag-Cu alloy layer, said layers arranged between said another surface of said insulating substrate and said inner surface of said closed end. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13)
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Specification
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Current AssigneeMatsushita Electric Industrial Company Limited (Panasonic Holdings Corporation)
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Original AssigneeMatsushita Electric Industrial Company Limited (Panasonic Holdings Corporation)
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InventorsNagai, Takeshi, Yamamoto, Kazushi, Kobayashi, Ikuo
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Primary Examiner(s)Albritton, C. L.
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Application NumberUS06/363,498Time in Patent Office644 DaysField of Search338/22 R, 338/22 SD, 338/25, 338/23, 338/24, 338/28, 338/308, 338/309, 374/185, 374/208US Class Current338/22.00RCPC Class CodesH01C 1/034 the housing or enclosure be...H01C 7/041 formed as one or more layer...
