Transfer molding method and transfer molding machine

• US 4,426,341 A
• Filed: 08/26/1982
• Issued: 01/17/1984
• Est. Priority Date: 09/28/1979
• Status: Expired due to Term

• Current Assignee: Hitachi, Ltd.
• Original Assignee: Hitachi, Ltd.
• Inventors: Saeki, Junichi, Kaneda, Aizo, Tsuzuku, Susumu, Aoki, Masayoshi
• Primary Examiner(s): Pavelko, Thomas P.
• Application Number:
  US06/411,759
• Time in Patent Office: 509 Days
• Field of Search: 425/136, 425/149, 425/170, 264/328.4, 264/328.5, 264/328.13, 264/40.1
• US Class Current: 264/40.1
• CPC Class Codes: B29C 45/02 Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
• CPC Class Codes: B29C 45/77 of velocity or pressure of moulding material

Abstract

A transfer molding machine for filling at least one cavity of a mold with a resin by means of a plunger including a resin pressure sensor for sensing the resin pressure in the mold, and a control device for controlling the pressure applied to the plunger to drive same in such a manner that an arbitrarily selected primary pressure higher than a holding pressure is applied to the plunger to drive same until the pressure of the resin charged into the mold which pressure is detected by the resin pressure sensor in the mold reaches a predetermined pressure level and a secondary pressure corresponding to the holding pressure is applied to the plunger to drive same after the predetermined pressure level has been exceeded by the pressure of the resin being charged into the mold sensed by the resin pressure sensor in the mold, and a warning device that issues a warning when the pressure applied to the plunger to drive has exceeded a predetermined pressure.

Claims

1. A method of transfer molding comprising the steps of:

(a) charging thermosetting resin into a mold having at least one runner and at least one cavity by applying pressure to the resin by a plunger;

(b) sensing the resin pressure in said mold by a resin pressure sensor; and

(c) controlling the pressure applied to the plunger during step (a) by applying a selected primary pressure to said plunger for driving said plunger until the pressure sensed in step (b) reaches a predetermined level and directly switching the pressure applied to the plunger to a secondary holding pressure that is lower than said primary pressure for driving said plunger upon said predetermined level being reached.

2. A method according to claim 1, comprising the further steps of:

(d) detecting whether or not the pressure for driving said plunger has reached a predetermined level; and

(e) issuing a warning when the pressure detected in step (d) exceeds said predetermined level.

3. A method according to claim 1 or 2, wherein step (b) is performed with the resin sensor mounted in one of the last filled cavity and a terminal end of said runner in the mold.

4. A method according to claim 1 or 2, wherein step (c) is performed by a plunger driving hydraulic circuit and control therefor comprising a primary pressure setting member for setting said primary pressure, a secondary pressure setting member for setting said secondary pressure, a change-over switch for selectively applying an output of said primary pressure setting member and an output of said secondary pressure setting member to said plunger in accordance with the pressure of the resin charged into said mold which pressure is detected by said resin pressure sensor, and a relief valve for controlling a maximum pressure in said hydraulic circuit by means of electrical switching by an output of said change-over switch.

5. A method according to claim 4, comprising the further steps of:

(d) detecting whether or not hydraulic pressure within said plunger driving hydraulic circuit has reached a predetermined level; and

(e) issuing a warning when the pressure detected in step (d) exceeds said predetermined level.

6. A method according to claim 1, wherein prior to step (a) an electronic part to be encapsulated in said resin is inserted in said at least one cavity.