Method of pattern formation

• US 4,434,224 A
• Filed: 01/29/1982
• Issued: 02/28/1984
• Est. Priority Date: 02/06/1981
• Status: Expired due to Term

• Current Assignee: Nippon Telegraph and Telephone Corporation
• Original Assignee: Nippon Telegraph and Telephone Corporation
• Inventors: Mizushima, Yoshihiko, Yoshikawa, Akira, Ochi, Osamu, Hisaki, Tomoko, Takeda, Akitsu
• Primary Examiner(s): Louie, Jr., Won H.
• Application Number:
  US06/343,908
• Time in Patent Office: 760 Days
• Field of Search: 430/314, 430/312, 430/313, 430/323, 430/324, 430/326, 430/330, 430/329, 430/5, 430/325, 156/659.1, 156/661.1
• US Class Current: 430/323
• CPC Class Codes: G03F 7/0035 Multiple processes, e.g. applying a further resist layer on an already in a previously step, processed pattern or textured surface
• CPC Class Codes: H01L 21/02107 Forming insulating materials on a substrate
• CPC Class Codes: H01L 21/0271 comprising organic layers
• CPC Class Codes: H01L 21/266 using masks H01L21/26586 takes precedence
• CPC Class Codes: H01L 21/302 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
• CPC Class Codes: H01L 21/314 Inorganic layers H01L21/3105, H01L21/32 take precedence

Abstract

In a method of pattern formation according to this invention, an organic polymer resist material is simultaneously used with an inorganic resist material, i.e., a first desired pattern consisting of the organic polymer resist material layer is formed on a substrate material, then the whole surface thereof is covered with the inorganic resist material layer, a second desired pattern is then formed with the inorganic resist material layer, and then the resulting second desired pattern is transferred to the organic polymer resist material. According to the invention, mask alignment can automatically be effected by detecting reflected light from an alignment mark on the substrate, formation of a relief including large and small patterns is also easily carried out, throughput can also be increased. The method of the invention may be combined with various process steps, so that such combined method is applicable for deep and shallow etching, formation of an interlayer insulation film, and lift-off method.

Claims

1. A method of pattern formation, which comprises the steps of:

forming an organic polymer resist material layer on the surface of a layer to be worked of a substrate;

exposing said organic polymer resist material layer with a first exposure pattern which relates to an alignment mark on said substrate;

developing the exposed organic polymer resist material layer to form a first desired pattern which does not cover said alignment mark;

applying a heat treatment to the patterned organic polymer resist material layer;

forming an inorganic resist material layer being a laminate consisting of a selenium-based glass material layer and a silver layer or layer containing silver on the organic polymer resist material layer thus heat-treated so as to cover the whole surface thereof and the whole exposed surface of said layer to be worked of the substrate material;

exposing said inorganic resist material layer with a second exposure pattern which relates to said alignment mark;

developing the exposed inorganic resist material layer to form a second desired pattern which does not cover said alignment mark;

etching to remove the organic polymer resist material layer in a region which is not covered with the patterned inorganic resist material layer;

applying an etching treatment to said layer to be worked in a region which is not covered with said organic polymer resist material layer; and

removing said inorganic and organic polymer resist material layers.

2. A method of pattern formation as defined in claim 1, wherein said organic polymer resist material layer is made from a resist material comprising cyclized polybutadiene rubber as the principal constituent.

3. A method of pattern formation as defined in claim 1, wherein said selenium-based glass material layer is made from a glass material comprising selenium and germanium as the principal constituents.

4. A method of pattern formation, which comprises the steps of:

forming an organic polymer resist material layer on the surface of a layer to be worked of a substrate;

exposing said organic polymer resist material layer with a first exposure pattern which relates to an alignment mark on said substrate;

developing the exposed organic polymer resist material layer to form a first desired pattern which does not cover said alignment mark;

applying a heat treatment to the patterned organic polymer resist material layer;

forming an inorganic resist material layer being a laminate consisting of a selenium-based glass material layer and a silver layer or layer containing silver on the organic polymer resist material layer thus heat-treated so as to cover the whole surface thereof and the whole exposed surface of said layer to be worked of the substrate material;

exposing said inorganic resist material layer with a second exposure pattern which relates to said alignment mark;

developing the exposed inorganic resist material layer to form a second desired pattern which does not cover said alignment mark;

etching to remove the organic polymer resist material layer in a region which is not covered with the patterned inorganic resist material layer;

removing said inorganic resist material layer;

applying an etching treatment to said layer to be worked in a region which is not covered with said organic polymer resist material layer; and

removing said organic polymer resist material layer.

5. A method of pattern formation as defined in claim 4, wherein said organic polymer resist material layer is made from a resist material comprising cyclized polybutadiene rubber as the principal constituent.

6. A method of pattern formation as defined in claim 4, wherein said selenium-based glass material layer is made from a glass material comprising selenium and germanium as the principal constituents.

7. A method of pattern formation, which comprises the steps of:

forming an organic polymer resist material layer on the surface of a layer to be worked of a substrate;

exposing said organic polymer resist material layer with a first exposure pattern which relates to an alignment mark on said substrate;

developing the exposed organic polymer resist material layer to form a first desired pattern which does not cover said alignment mark;

applying a heat treatment to the patterned organic polymer resist material layer;

etching to remove said layer to be worked in a region which is not covered with said patterned organic polymer resist material layer;

forming an inorganic resist material layer being a laminate consisting of a selenium-based glass material layer and a silver layer or layer containing silver on the organic polymer resist material layer thus heat-treated and the exposed layer to be worked by means of said etching treatment so as to cover the whole surface of said organic polymer resist material layer and the surface of said exposed layer to be worked;

exposing said inorganic resist material layer with a second exposure pattern which relates to said alignment mark;

developing the exposed inorganic resist material layer to form a second desired pattern which does not cover said alignment mark;

etching to remove the organic polymer resist material layer in a region which is not covered with the patterned inorganic resist material layer;

applying an etching treatment in said layer to be worked in a region which is not covered with said organic polymer resist material layer; and

removing said inorganic and organic polymer resist material layers.

8. A method of pattern formation as defined in claim 7, wherein said organic polymer resist material layer is made from a resist material comprising cyclized polybutadiene rubber as the principal constituent.

9. A method of pattern formation as defined in claim 7, wherein said selenium-based glass material layer is made from a glass material comprising selenium and germanium as the principal constituents.

10. A method of pattern formation, which comprises the steps of:

forming an organic polymer resist material layer on the surface of a layer to be worked of a substrate provided with a patterned conductor layer;

exposing said organic polymer resist material layer with a first exposure pattern which relates to an alignment mark on said substrate;

developing the exposed organic polymer resist material layer to form a first desired pattern which does not cover said alignment mark;

applying a heat treatment to said patterned organic polymer resist material layer;

forming an inorganic resist material layer being a laminate consisting of a selenium-based glass material layer and a silver layer or layer containing silver on the organic polymer resist material layer thus heat-treated so as to cover the whole surface thereof and the whole exposed surface of said layer to be worked of the substrate material;

exposing said inorganic resist material layer with a second exposure pattern which relates to said alignment mark;

developing the exposed inorganic resist material layer to form a second desired pattern which does not cover said alignment mark;

etching to remove the organic polymer resist material layer in a region which is not covered with the patterned inorganic resist material layer;

removing said inorganic resist material layer; and

forming a third desired pattern consisting of a conductor layer on said organic polymer resist material layer and said surface of layer to be worked of the substrate material in a region which is not covered with said organic polymer resist material layer.

11. A method of pattern formation as defined in claim 10, wherein said organic polymer resist material layer is made from a resist material comprising cyclized polybutadiene rubber as the principal constituent.

12. A method of pattern formation as defined in claim 10, wherein said selenium-based glass material layer is made from a glass material comprising selenium and germanium as the principal constituents.

13. A method of pattern formation, which comprises the steps of:

forming an organic polymer resist material layer on the surface of a layer to be worked of a substrate;

exposing said organic polymer resist material layer with a first exposure pattern which relates to an alignment mark on said substrate;

developing the exposed organic polymer resist material layer to form a first desired pattern which does not cover said alignment mark;

applying a heat treatment to the patterned organic polymer resist material layer,

forming an inorganic resist material layer being a laminate consisting of a selenium-based glass material layer and a silver layer or layer containing silver on the organic polymer resist material layer thus heat-treated so as to cover the whole surface thereof,

exposing said inorganic resist material layer with a second exposure pattern which relates to said alignment mark;

developing the exposed inorganic resist material layer to form a second desired pattern which does not cover said alignment mark;

etching to remove the organic polymer resist material layer in a region which is not covered with the patterned inorganic resist material layer,

forming a thin film layer on said inorganic resist material layer and said surface of layer to be worked of the substrate material in a region which is not covered with said organic polymer resist material layer, and

removing said inorganic and organic polymer resist material layer together with said thin film layer formed on said inorganic resist material layer.

14. A method of pattern formation as defined in claim 13, wherein said organic polymer resist material layer is made from a resist material comprising cyclized polybutadiene rubber as the principal constituent.

15. A method of pattern formation as defined in claim 13, wherein said selenium-based glass material layer is made from a glass material comprising selenium and germanium as the principal constituents.

16. A method of pattern formation, which comprises the steps of:

applying a heat treatment to the patterned organic pllymer resist material layer,

forming an inorganic resist material layer being a laminate consisting of a selenium-based glass material layer and a silver layer or layer containing silver on the organic polymer resist material layer thus heat-treated so as to cover the whole surface thereof,

etching to remove the organic polymer resist material layer in a region which is not covered with the patterned inorganic resist material layer,

removing said inorganic resist material layer,

forming a thin film layer on said organic polymer resist material layer and said surface of layer to be worked of the substrate material in a region which is not covered with said organic polymer resist material layer, and

removing said organic polymer resist material layer together with said thin film layer formed thereon.

17. A method of pattern formation as defined in claim 16, wherein said organic polymer resist material layer is made from a resist material comprising cyclized polybutadiene rubber as the principal constituent.

18. A method of pattern formation as defined in claim 16, wherein said selenium-based glass material layer is made from a glass material comprising selenium and germanium as the principal constituents.