Methods of marking and electrically identifying an article

• US 4,437,229 A
• Filed: 05/24/1982
• Issued: 03/20/1984
• Est. Priority Date: 12/06/1979
• Status: Expired due to Term

• Current Assignee: AT&T, Inc.
• Original Assignee: Western Electric Co., Inc. (Nokia Corporation)
• Inventors: Wilkinson, George F. Jr., Schneider, Fred J., Booth, Raymond H., Bitler, Joel R., Roman, Daniel J., Bodnar, Michael W., Seitzer, Philip W.
• Primary Examiner(s): Hall, Carl E.
• Assistant Examiner(s): Echols, P. W.
• Application Number:
  US06/381,129
• Time in Patent Office: 666 Days
• Field of Search: 324/158 F, 324/73 R, 324/73 PC, 219/121 LH, 219/121 LJ, 29/593, 29/620, 29/610 R, 29/854, 29/855, 29/856, 29/574, 357/85, 357/40
• US Class Current: 29/593
• CPC Class Codes: H01C 1/04 Arrangements of distinguishing marks, e.g. colour coding
• CPC Class Codes: H01L 21/67271 Sorting devices
• CPC Class Codes: H01L 21/67294 using identification means, e.g. labels on substrates or labels on containers
• CPC Class Codes: H01L 22/20 Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
• CPC Class Codes: H01L 2223/54473 for use after dicing
• CPC Class Codes: H01L 23/544 Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps test patterns for characterising or monitoring manufacturing processes H01L22/00
• CPC Class Codes: H01L 25/16 the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/3011 Impedance
• CPC Class Codes: H05K 1/0266 Marks, test patterns or identification means
• CPC Class Codes: H05K 1/029 having a programmable lay-out, i.e. adapted for choosing between a few possibilities
• CPC Class Codes: H05K 1/0293 Individual printed conductors which are adapted for modification, e.g. fusable or breakable conductors, printed switches
• CPC Class Codes: H05K 1/167 incorporating printed resistors
• CPC Class Codes: H05K 2203/107 Using laser light shaping a substrate by laser ablation H05K3/0026
• CPC Class Codes: H05K 2203/1115 Resistance heating, e.g. by current through the PCB conductors or through a metallic mask
• CPC Class Codes: H05K 2203/175 Configurations of connections suitable for easy deletion, e.g. modifiable circuits or temporary conductors for electroplating; Processes for deleting connections
• CPC Class Codes: H05K 3/027 the conductive material being removed by irradiation, e.g. by photons, alpha or beta particles
• CPC Class Codes: Y10T 29/49004 including measuring or testing of device or component part
• CPC Class Codes: Y10T 29/49099 Coating resistive material on a base
• CPC Class Codes: Y10T 29/49169 : Assembling electrical component directly to terminal or elongated conductor

Abstract

A hybrid integrated circuit package (11) typically includes a circuit substrate or article (12) on which are formed thin film components (17, 18, 19) of a circuit (22) and to which is bonded at least one semiconductor chip (21). Prior to bonding the chip (21) to the article (12) the circuit (22) undergoes various tests and adjustment operations. An electric element, preferably a resistance element (36), is formed on the article (12). The element (36) is functionally independent of the circuit (22) on the article (12). A first, initial value of the element (36) marks the article (12) as belonging to a first group of articles having first circuit characteristics. The initial value of the element (36) is selectively altered to a second value upon a determination that the article (12) has circuit characteristics other than those of the first group. In the described preferred embodiment the first group is a group of electrically acceptable articles (12), while other characteristics are those of defective articles. The mark is typically altered by a current of sufficient magnitude to burn portions of the element (36), or by selective application of radiant energy such as a laser beam (83). Identifying the altered mark permits articles (12) having defective circuits thereon to be selectively eliminated from further processing steps.

Claims

1. A method of making electronic articles, said articles including substrates and circuit elements supported by such substrates, wherein said circuit elements are tested and said articles are selectively grouped and marked based on the outcome of such tests, which comprises:

forming at least one distinct resistive element of a first relatively low resistive value on each such substrate, said at least one distinct resistive element being functionally separate from any such circuit elements, said first resistive value of said at least one resistive element identifying such article as one of a first group of at least two groups of said articles as may be determined by said tests;

testing said articles;

applying energy to at least one such distinct resistive element on the substrate of any of said tested articles with respect to which such testing has determined that such articles are not of such first group, such energy altering said first resistive value to a second relatively high resistive value with respect to such first resistive value; and

prior to further steps involving a selective treatment of the articles of such first group, measuring the resistive value of such at least one distinct resistive element of such tested articles to determine whether such articles are of such first group of articles.

2. A method according to claim 1, wherein applying energy comprises:

coupling a current source across terminals of at least one such resistive element, whereby a resulting current flow alters said relatively low resistance to such comparatively higher resistance.

3. A method according to claim 1, wherein said distinct resistive elements are formed of a film material and applying energy comprises:

impinging a selectively applied energy beam against at least one such resistive element, such beam selectively destroying at least portions of such film material, whereby said relatively low resistance of said at least one resistive element changes to such comparatively higher resistance.