Low profile optical coupling for an optoelectronic module

• US 4,438,338 A
• Filed: 11/05/1981
• Issued: 03/20/1984
• Est. Priority Date: 11/05/1981
• Status: Expired due to Fees

• Current Assignee: Burr-Brown Research Corporation (Texas Instruments, Inc.)
• Original Assignee: Burr-Brown Research Corporation (Texas Instruments, Inc.)
• Inventors: Stitt, Robert M., Albaugh, Neil P.
• Primary Examiner(s): Sikes, William L.
• Assistant Examiner(s): Hostetter, Darwin R.
• Application Number:
  US06/318,475
• Time in Patent Office: 866 Days
• Field of Search: 250/551, 250/227, 250/239, 350/96.10
• US Class Current: 250/551
• CPC Class Codes: G02B 6/4204 the coupling comprising intermediate optical elements, e.g. lenses, holograms encapsulated active devices H01S5/02208, H01L33/52
• CPC Class Codes: G02B 6/4206 Optical features G02B6/4207, G02B6/421 take precedence
• CPC Class Codes: G02B 6/4226 Positioning means for moving the elements into alignment, e.g. alignment screws, deformation of the mount
• CPC Class Codes: G02B 6/4239 Adhesive bonding; Encapsulation with polymer material
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01327 Intermediate phases, i.e. intermetallics compounds
• CPC Class Codes: H01L 2924/12041 LED
• CPC Class Codes: H01L 31/16 the semiconductor device sensitive to radiation being controlled by the light source or sources
• CPC Class Codes: H01L 33/60 Reflective elements
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

Means and method is disclosed for achieving a low profile optical coupling to a module comprising an optoelectronic device together with other circuitry. Maintaining the optoelectronic device parallel to the substrate on which it and the associated circuitry are mounted enables the use of standard, well known manufacturing assembly techniques while providing electrical connection to the electric ports of said optoelectronic device. Subsequent to the electrical interconnection operation, the optoelectronic device is moved, together with its connections, to a position substantially orthogonal with the mounting substrate. Optical fiber, light coupling is utilized. The low profile of the overall module package is achieved by introducing the optical fiber in a direction generally parallel with the substrate and perpendicular to the light active surface of the optic port of the optoelectronic device. The structure and method are applicable to both hybrid integrated circuit assembly technology as well as to conventional metallic lead frames for plastic encapsulation.

Claims

1. A fiber optic module comprising a substrate bearing conductive surface portions parallel to a first plane, an optical fiber, and an optoelectronic device located substantially orthogonal to said first plane comprising two electrodes and having a planar light-coupling surface portion coupled to said optical fiber;

one of said conductive surface portions of said substrate being electrically connectable to a signal processing circuit mounted on said substrate;

first flexible conductive means for providing an electrical connection to said one of said conductive surface portions;

metal deformable device mounting means including a first portion substantially parallel with said first plane and a second movable portion substantially orthogonal to said first plane for providing optical alignment and mechanical support for and electrical contact to said optoelectronic device; and

second flexible conductive means of the same type as said first flexible conductive means attached to one of said electrodes of said optoelectronic device for electrically coupling said electrode to one of said conductive surface portions, said second flexible conductive means being attached to said optoelectronic device when its planar light-coupling surface portion is substantially orthogonal to said first plane.

2. The module of claim 1, where said deformable mounting means is an integral portion of said substrate.

3. The module of claim 1 further comprising second deformable mounting means for supporting said fiber optic.

4. The module of claim 1, said deformable mounting means comprising a shaped reflective portion for enhancing the efficiency of said module.

5. The module of claim 1, said deformable mounting means further comprising a third portion substantially orthogonal to said substrate for aligning and supporting said optical fiber.

6. A method for assembling a fiber optic module including a substrate bearing conductive surface portions parallel with a first plane and an optoelectronic device having a planar light-coupling surface portion substantially orthogonal to said first plane, comprising the steps of:

mounting on said substrate a deformable member having device-bearing portion substantially parallel with said substrate;

mounting said device on said device-bearing portion of said member;

electrically connecting said light-coupling surface portion with one of said conductive surface portions on said substrate; and

deforming said member to cause said device surface portion to assume a position substantially orthogonal to said first plane subsequent to said electrically connecting step.

7. The method of claim 6, further comprising electrically interconnecting other of said conductive portions along with said electrically connecting step.