×

On-line inspection method and system for bonds made to electronic components

  • US 4,441,248 A
  • Filed: 12/02/1982
  • Issued: 04/10/1984
  • Est. Priority Date: 12/02/1982
  • Status: Expired due to Fees
First Claim
Patent Images

1. A method of making on-line inspection of electric characteristics of a semiconductor device during a step of bonding a lead wire to a chip surface of said semiconductor device in the process of fabricating an electronic component, comprising:

  • applying an electric power across said lead wire which is to be bonded to said chip, and bonded to connectors which serve as electric terminals when said semiconductor device is assembled into an electronic component.

View all claims
  • 1 Assignment
Timeline View
Assignment View
    ×
    ×