On-line inspection method and system for bonds made to electronic components

• US 4,441,248 A
• Filed: 12/02/1982
• Issued: 04/10/1984
• Est. Priority Date: 12/02/1982
• Status: Expired due to Fees

• Current Assignee: Stanley Electric Company Limited
• Original Assignee: Stanley Electric Company Limited
• Inventors: Wood, Van E., Sherman, Rand C.
• Primary Examiner(s): Hearn, Brian E.
• Assistant Examiner(s): Hey, David A.
• Application Number:
  US06/446,174
• Time in Patent Office: 495 Days
• Field of Search: 29/569 L, 29/574, 29/584, 29/585, 29/586, 29/589, 228/179, 324/71.6, 324/73 PC, 324/149, 324/158 D, 324/158 T
• US Class Current: 438/15
• CPC Class Codes: H01L 22/12 for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions electrical measurement of diffusions H01L22/14
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2224/4823 connecting the wire to a pin of the item
• CPC Class Codes: H01L 2224/48245 the item being metallic
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48465 the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
• CPC Class Codes: H01L 2224/78301 Capillary
• CPC Class Codes: H01L 2224/85181 connecting first on the semiconductor or solid-state body, i.e. on-chip, regular stitch
• CPC Class Codes: H01L 2224/85205 Ultrasonic bonding
• CPC Class Codes: H01L 2224/859 involving monitoring, e.g. feedback loop
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/78 Apparatus for connecting with wire connectors
• CPC Class Codes: H01L 24/85 using a wire connector wire bonding in general B23K20/004
• CPC Class Codes: H01L 24/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01005 Boron [B]
• CPC Class Codes: H01L 2924/01006 : Carbon [C]
• CPC Class Codes: H01L 2924/01014 : Silicon [Si]
• CPC Class Codes: H01L 2924/01023 : Vanadium [V]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/10329 : Gallium arsenide [GaAs]
• CPC Class Codes: H01L 2924/12041 : LED
• CPC Class Codes: H01L 2924/13034 : Silicon Controlled Rectifier [SCR]

Abstract

On-line inspection of electric characteristics of a semiconductor device can be achieved during a step of bonding a lead wire to a chip surface of the semiconductor device in the process of fabricating an electronic component, by the use of a circuit arrangement formed between a lead wire fed from a bonder and connectors serving as electric terminals when the chip is mounted thereon to be made into an electronic component, and by the application of electric power thereto.

Claims

1. A method of making on-line inspection of electric characteristics of a semiconductor device during a step of bonding a lead wire to a chip surface of said semiconductor device in the process of fabricating an electronic component, comprising:

applying an electric power across said lead wire which is to be bonded to said chip, and bonded to connectors which serve as electric terminals when said semiconductor device is assembled into an electronic component.

2. A method according to claim 1 in which said semiconductor device is a diode.

3. A method according to claim 1 in which said semiconductor device is a light-emitting diode.

4. A method according to claim 1 in which said semiconductor device is provided in plural number on a semiconductor support.

5. A method according to claim 1 in which measurements or observations are made of the amount of the characteristics of the power that has been applied after said lead wire has been bonded to said chip.

6. A system for making on-line inspection of electric characteristics of a semiconductor device during a step of bonding a lead wire to a chip surface of said semiconductor device in the process of fabricating an electronic component, comprising:

a. an electroconductive base means;

b. an electroconductive cathode connector means projecting from one surface of said base means and carrying, at its free end, a reflector means securely receiving a semiconductor chip bearing on its surface an ohmic contact metal electrode;

c. an electroconductive anode connector means projecting from a surface of the base mans adjacent to said cathode connector means and forming a pair therewith;

d. a capillary means movably positionable above said cathode connector means and said chip and positionable over said anode connector means for feeding a lead wire to be bonded to said connector means; and

e. an electric circuit means formed between said base means and said lead wire via said capillary means and connected to a power supply and having an on/off switching means for applying and cutting an electric power across said lead wire and said base means.

7. A system according to claim 6 in which said cathode connector means and said anode connector means are connected by a bar.

8. A system according to claim 7 in which said bar is an electroconductive bar and serves as an anode connector means to replace the projecting anode connector means.

9. A system according to claim 6 wherein measuring or observation means is provided in said electric circuit means for determining the characteristics of the power in the circuit.