Heat sensing device

• US 4,444,990 A
• Filed: 09/08/1982
• Issued: 04/24/1984
• Est. Priority Date: 09/08/1982
• Status: Expired due to Fees

• Current Assignee: Business Alliance Capital Corp. (Banco Santander SA)
• Original Assignee: Servo Corporation of America
• Inventors: Villar, Luis F.
• Primary Examiner(s): Sebastian, Leland A.
• Application Number:
  US06/416,055
• Time in Patent Office: 594 Days
• Field of Search: 29/573, 136/221, 136/230, 374/179, 374/208, 374/209
• US Class Current: 136/221
• CPC Class Codes: G01K 1/16 Special arrangements for conducting heat from the object to the sensitive element
• CPC Class Codes: G01K 7/04 the object to be measured not forming one of the thermoelectric materials

Abstract

An improved heat sensing tip for a temperature sensing device is provided. The tip comprises an elongated shell of heat conductive material. A temperature probe is positioned for movement within the shell toward and away from an opening in the shell. A cap of heat conductive material is positioned at the front of the probe. A spring urges the cap in contact with the shell for heat conductivity between the two when the device is not in operation. When the device is in operation, the spring bias is overcome thereby providing an insulating air gap between the shell and the tip.

Claims

1. A temperature sensing device comprising:

a housing formed of a heat conductive material;

a cavity within said housing;

an opening in said housing communicating with said cavity;

a heat probe positioned for movement within said cavity and through said opening from (1) a first position wherein portions of said probe contact said heat conductive surface so as to establish a heat conductive path between said probe and said housing to (2) a second position wherein said probe is insulated from said housing and positioned to take a temperature reading.

2. The invention in accordance with claim 1 further comprising spring means biasing said probe toward said first position.

3. The invention in accordance with claims 1 or 2 wherein said probe comprises a block of insulating material;

a cap of heat conductive material positioned at an end of said black, said cap being dimensioned to pass through said opening; and

a tapered rim of conductive material extending from said cap;

a portion of said rim being dimensioned to engage said opening whereby to bring said probe into heat conductive contact with said housing.

4. The invention in accordance with claim 3 further comprising a thermocouple secured to said cap and electrical connections extending through said block to said thermocouple.

5. The invention in accordance with claims 1, 2, 3 or 4 further comprising a case;

an elongated stem extending from said case, said housing being positioned at the free end of said stem; and

spring means flexibly coupling said housing to said stem free end.