LED Module for a flat panel display unit

• US 4,445,132 A
• Filed: 06/03/1981
• Issued: 04/24/1984
• Est. Priority Date: 06/13/1980
• Status: Expired due to Fees

• Current Assignee: Tokyo Shibaura Denki Kabushiki Kaisha 72 Horikawa-Cho Saiwai-Ku Kawasaki-Shi Japan
• Original Assignee: Tokyo Shibaura Denki Kabushiki Kaisha
• Inventors: Ichikawa, Osamu, Sadamasa, Tetsuo
• Primary Examiner(s): James, Andrew J.
• Assistant Examiner(s): Nehrbass, Seth
• Application Number:
  US06/270,030
• Time in Patent Office: 1,056 Days
• Field of Search: 340/782, 340/719, 340/815.01, 340/825.02, 313/500, 357/17, 357/32, 358/241
• US Class Current: 257/72
• CPC Class Codes: G09F 9/3026 Video wall, i.e. stackable semiconductor matrix display modules video wall control systems G06F3/1446, G09G2300/026
• CPC Class Codes: G09F 9/33 being semiconductor devices, e.g. diodes
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48228 the bond pad being disposed in a recess of the surface of the item
• CPC Class Codes: H01L 2224/48464 the other connecting portion not on the bonding area also being a ball bond, i.e. ball-to-ball
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Abstract

One surface of a substrate of an LED module for a flat panel display has 8×8 element areas divided into a matrix form. Row electrodes extend on element areas arranged along the row direction, and column electrodes insulated from the row electrodes extend on element areas arranged in the column direction. At least one LED pellet is disposed for each element area and is connected to the row and column electrode associated with this area. A connecting pad is disposed as spaced apart from the four pellets in a unit area defined as a region consisting of four element areas. This connecting pad is connected to one of the row and column electrodes in the four element areas and is also connected through the substrate to a connecting pin arranged on the other surface of the substrate of the LED module.

Claims

1. An LED module for a flat panel display unit, comprising:

a rectangular flat substrate having first and second opposed surfaces, wherein said first surface is uniformly divided into a matrix of plural unit areas arranged in rows and columns, each unit area including four picture element areas defining rows and columns of a 2×

2 matrix within the matrix of said unit areas;

plural first column electrodes formed on the substrate, each first column electrode extending along a column of said element areas;

plural first row electrodes insulated from said first column electrodes, each first row electrode extending along a row of said element areas;

plural first LED pellets each arranged in a respective element area and each electrically connected to a respective first column electrode and a respective first row electrode;

plural connecting pads each arranged on a respective unit area, each pad being spaced apart from the LED pellets arranged on the four picture element areas defining its respective unit area; and

plural connecting pins each secured to the second surface of said substrate to project therefrom, each connecting pin connected electrically to a respective connecting pad.

2. An LED module according to claim 1, wherein said first surface of said substrate is uniformly divided into a matrix of 64 element areas arranged in 8 rows and 8 columns.

3. An LED module according to claim 1, wherein said first LED pellets emit monochromatic light.

4. An LED module according to claim 3, wherein said LED module further comprises:

plural second row electrodes insulated from said first column electrodes and said first row electrodes and each respectively extending along the row of element areas along which said first row electrodes respectively extend; and

plural second LED pellets for emitting light of a different color from that emitted by said first LED pellets, each second LED pellet arranged in a respective element area and electrically connected between said first column electrode and said second row electrode.

5. An LED according to claim 4, wherein said first surface of said substrate is uniformly divided into 144 element areas arranged in 12 rows and 12 columns.

6. An LED module according to claim 4, wherein said LED module further comprises:

plural third row electrodes insulated from said first column electrodes and said first and second row electrodes and each respectively extending along the row of element areas along which said first and second row electrodes respectively extend, and

plural third LED pellets for emitting light of a different color from that emitted by said first and second LED pellets, each third LED pellets arranged in a respective element area and electrically connected between said first column electrode and said third row electrode.

7. An LED module according to claim 6, wherein said one surface of said substrate is uniformly divided into 256 element areas arranged in 16 rows and 16 columns.

8. An LED module according to claim 1, wherein each of said connecting pads is disposed substantially at the center of its respective unit area.

9. An LED device according to claim 1, wherein each unit area has a respective connecting pad arranged therein.

10. An LED module according to claim 1, wherein each of said connecting pads and each of said connecting pins are connected through a respective through hole formed in said substrate.

11. An LED module according to claim 1, wherein said connecting pins have a pitch equal to 2.54 mm.

12. An LED module according to claim 1, wherein each said element area has dimensions of 1.27 mm×

1.27 mm.

13. An LED module according to claim 1, comprising:

an insulative layer insulating said first row electrodes from said first column electrodes.