Multi-layered circuit board

• US 4,446,188 A
• Filed: 12/20/1979
• Issued: 05/01/1984
• Est. Priority Date: 12/20/1979
• Status: Expired due to Term

• Current Assignee: Mica Corp.
• Original Assignee: Mica Corp.
• Inventors: Illick, Andjelko, Patel, Harshad K.
• Primary Examiner(s): KENDELL, LORRAINE
• Application Number:
  US06/105,723
• Time in Patent Office: 1,594 Days
• Field of Search: 428/140, 428/139, 428/138, 428/131, 428/192, 428/78, 428/457, 428/320, 428/322, 428/901, 428/458, 428/464, 428/426, 428/418, 428/460, 428/480, 428/473.5, 174/68.5, 29/625, 29/626
• US Class Current: 428/138
• CPC Class Codes: B32B 15/08 of synthetic resin
• CPC Class Codes: B32B 2311/12 Copper
• CPC Class Codes: B32B 2315/085 Glass fiber cloth or fabric
• CPC Class Codes: H05K 1/0287 having an universal lay-out, e.g. pad or land grid patterns or mesh patterns
• CPC Class Codes: H05K 1/029 having a programmable lay-out, i.e. adapted for choosing between a few possibilities
• CPC Class Codes: H05K 1/0298 Multilayer circuits
• CPC Class Codes: H05K 1/0393 Flexible materials H05K1/038 takes precedence; specific organic compositions are classified in H05K1/0313 and subgroups
• CPC Class Codes: H05K 2201/0355 Metal foils
• CPC Class Codes: H05K 2201/093 Layout of power planes, ground planes or power supply conductors, e.g. having special clearance holes therein reduction of cross-talk, noise or interference by patterned shielding planes, ground planes or power planes H05K1/0224
• CPC Class Codes: H05K 2201/09609 Via grid, i.e. two-dimensional array of vias or holes in a single plane interposers H05K2201/10378
• CPC Class Codes: H05K 2201/09945 Universal aspects, e.g. universal inner layers or via grid, or anisotropic interposer
• CPC Class Codes: H05K 2203/0323 Working metal substrate or core, e.g. by etching, deforming
• CPC Class Codes: H05K 2203/1545 Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
• CPC Class Codes: H05K 3/0052 Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
• CPC Class Codes: H05K 3/064 Photoresists
• CPC Class Codes: H05K 3/427 initial plating of through-holes in metal-clad substrates
• CPC Class Codes: H05K 3/429 Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
• CPC Class Codes: H05K 3/44 Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits H05K3/0058, H05K3/4608, and H05K3/4641 take precedence
• CPC Class Codes: H05K 3/445 having insulated holes or insulated via connections through the metal core
• CPC Class Codes: H05K 3/4635 laminating flexible circuit boards using additional insulating adhesive materials between the boards
• CPC Class Codes: H05K 3/4641 : having integrally laminated metal sheets or special power cores
• CPC Class Codes: Y10S 428/901 : Printed circuit
• CPC Class Codes: Y10T 428/24331 : including nonapertured component
• CPC Class Codes: Y10T 428/24777 : Edge feature
• CPC Class Codes: Y10T 428/31529 : Next to metal
• CPC Class Codes: Y10T 428/31678 : Of metal
• CPC Class Codes: Y10T 428/31681 : Next to polyester, polyamide or polyimide [e.g., alkyd, glue, or nylon, etc.]
• CPC Class Codes: Y10T 428/31688 : Next to aldehyde or ketone condensation product
• CPC Class Codes: Y10T 428/31703 : Next to cellulosic
• CPC Class Codes: Y10T 428/31721 : Of polyimide
• CPC Class Codes: Y10T 428/31786 : Of polyester [e.g., alkyd, etc.]

Abstract

A layered clad laminate with universal center plane adapted for the manufacture of printed wiring board comprising an electrically conductive self-sustaining, integral metal center sheet having, in repetitive fashion, a series of predetermined patterns of punched or photochemically developed openings therein, said sheet being pressed between electrical insulating layers of resin impregnated reinforcing material, said layers being adhered to said sheet and to each other through said openings, and on each of the outer surfaces of said laminate and adhered thereto a layer of electrically conductive metal foil which is essentially uniform and imperforate.

Claims

1. A layered clad laminate with universal center plane adapted for the manufacture of printed wiring board comprising an electrically conductive self-sustaining, integral metal center sheet having, in repetitive fashion a series of predetermined patterns of drilled, punched or photochemically developed openings therein, said sheet being pressed between electrical insulating layers of resin impregnated reinforcing material, said layers being adhered to said sheet and to each other through said openings, and on each of the outer surfaces of said laminate and adhered thereto a layer of electrically conductive metal foil which is essentially uniform and imperforate.

2. The laminate of claim 1 wherein the conductive metal is copper.

3. The laminate of claim 1 wherein the center sheet comprises a series of larger sections joined by smaller connecting bridges which are adapted to be removed to provide for a plurality of electrically isolated sections.

4. The laminate of claim 1 wherein the center sheet weighs from about 1 to 2 ounces per square foot of area.

5. The laminate of claim 1 wherein the center sheet terminates short of the edge of the laminate to provide an insulating peripheral margin in said laminate.