Telescoping thermal conduction element for cooling semiconductor devices
First Claim
1. An extensible bridge element for use in a semiconductor package to conduct heat from a semiconductor device to a cold plate located in close proximity to the device comprisinga first plate to be placed in contact with a semiconductor device surfacea first spiral strip of thin heat conductive material joined along an edge to said first plate,a second plate to be placed in contact with a heat sink surface spaced from said device surface,a second spiral strip of thin heat conductive material interleaved with said first spiral strip in a laterally displaced overlapping and slideably contacting telescoping relation, said second spiral strip joined along an edge to said second plate, andmeans to bias said first and said second plates outwardly relative to each other, said element capable in use of adjusting to spacing variations between the device surface and heat sink surface.
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Accused Products
Abstract
A thermal bridge element for use in a semiconductor package to conduct heat from a semiconductor device to a cold plate or cap located in close proximity to the device having a first plate to be placed in contact with a semiconductor device surface, a first spiral strip of heat conductive material joined to the first plate, a second plate to be placed in contact with a heat sink surface or cap spaced from the device surface, and a second spiral strip of thin heat conductive material interleaved with the first spiral strip and in partially overlapping telescoping relation, the second spiral strip joined to the second plate, and a means to bias the first and second plate outwardly relative to each other.
57 Citations
7 Claims
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1. An extensible bridge element for use in a semiconductor package to conduct heat from a semiconductor device to a cold plate located in close proximity to the device comprising
a first plate to be placed in contact with a semiconductor device surface a first spiral strip of thin heat conductive material joined along an edge to said first plate, a second plate to be placed in contact with a heat sink surface spaced from said device surface, a second spiral strip of thin heat conductive material interleaved with said first spiral strip in a laterally displaced overlapping and slideably contacting telescoping relation, said second spiral strip joined along an edge to said second plate, and means to bias said first and said second plates outwardly relative to each other, said element capable in use of adjusting to spacing variations between the device surface and heat sink surface.
Specification