Cathode arrangement for sputtering material from a target in a cathode sputtering unit
First Claim
1. A cathode arrangement for sputtering material from a target in a cathode sputtering unit, comprising a frame-shape magnet being disposed adjacent the target remote from the surface to be sputtered, and another magnet being provided within said frame-shap magnet, and with the directions of magnetization of the two magnets forming an angle of between 45°
- and 90°
, said frame-shape magnet being made of a permanent-magnet mterial having an energy density of at least 40 kJ per m3 and the other magnet being made of a permanent-magnet material having an energy density of less than 40 kJ per m3.
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Accused Products
Abstract
A cathode arrangement for sputtering material from a target in a cathode sputtering unit comprises a frame-shape magnet disposed adjacent the target and remote from the surface to be sputtered and another magnet located within the frame-shape magnet. The directions of magnetization of the two magnets form an angle of from 45 to 90 degrees. The frame-shape magnet is made of a permanent magnet material having an energy density of at least 40 kJ per m3. The other magnet is made of a permanent magnet material having an energy density of less than 40 kJ per m3.
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Citations
10 Claims
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1. A cathode arrangement for sputtering material from a target in a cathode sputtering unit, comprising a frame-shape magnet being disposed adjacent the target remote from the surface to be sputtered, and another magnet being provided within said frame-shap magnet, and with the directions of magnetization of the two magnets forming an angle of between 45°
- and 90°
, said frame-shape magnet being made of a permanent-magnet mterial having an energy density of at least 40 kJ per m3 and the other magnet being made of a permanent-magnet material having an energy density of less than 40 kJ per m3. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
- and 90°
Specification