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Cathode arrangement for sputtering material from a target in a cathode sputtering unit

  • US 4,448,653 A
  • Filed: 10/30/1981
  • Issued: 05/15/1984
  • Est. Priority Date: 10/14/1980
  • Status: Expired due to Fees
First Claim
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1. A cathode arrangement for sputtering material from a target in a cathode sputtering unit, comprising a frame-shape magnet being disposed adjacent the target remote from the surface to be sputtered, and another magnet being provided within said frame-shap magnet, and with the directions of magnetization of the two magnets forming an angle of between 45°

  • and 90°

    , said frame-shape magnet being made of a permanent-magnet mterial having an energy density of at least 40 kJ per m3 and the other magnet being made of a permanent-magnet material having an energy density of less than 40 kJ per m3.

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