Method and apparatus for encapsulation of chemically sensitive field effect device

• US 4,449,011 A
• Filed: 01/08/1982
• Issued: 05/15/1984
• Est. Priority Date: 01/08/1982
• Status: Expired due to Term

• Current Assignee: Critikon Co. LLC
• Original Assignee: Critikon, Inc.
• Inventors: Janata, Jiri, Kratochvil, Jiri, Ho, Nelson
• Primary Examiner(s): Truhe, J. V.
• Assistant Examiner(s): TONE, DAVID
• Application Number:
  US06/350,929
• Time in Patent Office: 858 Days
• Field of Search: 174/52 PE, 174/52 FP, 174/117 F, 174/117 FF, 339/17 F, 339/17 M
• US Class Current: 174/524
• CPC Class Codes: G01N 27/414 Ion-sensitive or chemical field-effect transistors, i.e. ISFETS or CHEMFETS

Abstract

Semiconductor chips carrying chemically sensitive field effect devices are encapsulated by tape automated bonding techniques, wherein one tape layer has a beam lead pattern disposed thereon which terminates in the chip bonding pad pattern over an opening in the tape. A tape layer for sealably covering the beam lead pattern and the chip has openings which are respectively coincident with the chemically selective membrane systems of the field effect devices.

Claims

1. For use in an apparatus employing a semiconductor chip having lead bonding pads and carrying at least one chemically sensitive field effect device which interacts with select ambient substances by means of one or more exposed selectively reactive membrane systems, an encapsulation system comprising:

tape means having conductive beam leads disposed thereon, said tape means defining an area to accommodate said chip, said beam leads terminating in first ends over said area, said tape means further defining first openings which are respectively adapted to be coincident with said membrane systems;

wherein said tape means comprises respective first and second tapes, said first tape carrying said beam leads and said second tape defining a second opening coincident with the first ends of said beam leads, said first tape further defining said first openings;

said tape means sealably overlaying at least said beam leads;

whereby said tape means and a chip when connected thereto, will be aligned to leave exposed only at least a portion of each of said membrane systems.

2. An encapsulation system as described in claim 1 wherein said means to sealably overlay comprises a third tape.

3. An encapsulation system as described in claim 1 wherein said first and second tapes are respectively oppositely facing members and are substantially nonreactive to said ambient substances.

4. For use in an apparatus employing a semiconductor chip having lead bonding pads and carrying at least one chemically sensitive field effect device which interacts with select ambient substances by means of one or more exposed selectively reactive membrane systems, an encapsulation system comprising:

tape means having conductive beam leads disposed thereon, said tape means defining an area to accommodate said chip, said beam leads terminating in first ends over said area, said tape means further defining first openings which are respectively adapted to be coincident with said membrane systems;

wherein said tape means defines second openings coincident with the first ends of said beam leads for affixation of said beam leads and carries said beam leads on a lower side for facing said chip, said tape means defining an outer hermetic seal for said device except for said openings; and

wherein said system further comprises sealing means for oppositely facing said lower side, said beam leads and a back side of said device;

said tape means sealably overlaying at least said beam leads;

whereby said tape means and a chip when connected thereto, will be aligned to leave exposed only at least a portion of each of said membrane systems.