Microelectrodes and process for shielding same

• US 4,452,249 A
• Filed: 12/01/1981
• Issued: 06/05/1984
• Est. Priority Date: 12/01/1981
• Status: Expired due to Fees

• Current Assignee: The Research Foundation for The State University of New York (State University of New York)
• Original Assignee: The Research Foundation for The State University of New York (State University of New York)
• Inventors: Sachs, Frederick, McGarrigle, Richard G.
• Primary Examiner(s): Kaplan, G. L.
• Assistant Examiner(s): Nguyen, Nam X.
• Application Number:
  US06/326,388
• Time in Patent Office: 917 Days
• Field of Search: 204/195 R, 204/195 G, 204/195 L, 204/195 M, 128/642, 128/635, 128/784, 427/58, 427/79, 427/81, 427/125, 427/273, 134/2, 156/656
• US Class Current: 600/396
• CPC Class Codes: A61B 5/25 Bioelectric electrodes therefor
• CPC Class Codes: A61B 5/262 Needle electrodes
• CPC Class Codes: A61B 5/263 characterised by the electrode materials
• CPC Class Codes: A61B 5/265 containing silver or silver chloride
• CPC Class Codes: A61N 1/044 Shape of the electrode

Abstract

A shielded microelectrode process and product wherein the microelectrode is coated by vacuum evaporation techniques with a thin layer of silver; the silver from the microelectrode tip region is removed to a depth of no greater than substantially 20 micrometers by contact with memory; and the microelectrode is dipped into a thermosetting wax in liquid form whereby as the wax solidifies the silver is coated thereby below the tip region.

Claims

1. A method of shielding microelectrodes, including the steps of:

coating the exterior surface of a microelectrode having a central throughopening by vacuum evaporation techniques to provide a thin layer of conductive material thereabout; and

removing a controlled layer of conductive material from a circumferential tip area of said microelectrode leaving a tip region thereof exposed.

2. The method according to claim 1, wherein:

said step of removing comprises contacting said tip area with mercury whereby said conductive material is dissolved without clogging said central throughopening.

3. The method according to claim 2, wherein:

said conductive material is silver.

4. The method according to claim 2, wherein:

said conductive material is chosen from the noble metal group.

5. The method according to claim 4, wherein:

said controlled layer of conductive material is removed to a depth no greater than substantially 20 micrometers from said tip.

6. The method according to any one of claims 1, 2, 4, or 5 further comprising the step of:

dipping said microelectrode, tip first, into a liquid insulating material whereby as the insulating material solidifies about the microelectrode said layer of conductive material and a portion of said tip region is completely covered by said insulating material leaving the remainder of said tip region and said central throughopening fully exposed.

7. The method according to claim 6, wherein:

said insulating material comprises a thermosetting wax.

8. A shielded microelectrode, comprising:

a microelectrode body having a throughopening extending from a shank end of said body to the operative tip end thereof;

a thin layer of conductive material applied to said microelectrode body by vacuum evaporation, said conductive material adhering in surrounding relation to the exterior of said body short of the tip thereof to thereby leave an exposed exterior tip portion of no greater than substantially 20 micrometers, and

a layer of insulating material covering said conductive material and a portion of said exposed tip.

9. The microelectrode according to claim 8 wherein:

said conductive material is chosen from the noble metal group.

10. The microelectrode according to claim 9 wherein:

said insulating material comprises a thermosetting wax.

11. The microelectrode according to claim 9, wherein:

said conductive material is silver.