Interferometric method and apparatus for measuring etch rate and fabricating devices

• US 4,454,001 A
• Filed: 08/27/1982
• Issued: 06/12/1984
• Est. Priority Date: 08/27/1982
• Status: Expired due to Term

• Current Assignee: Bell Telephone Laboratories, Inc. (Nokia Corporation)
• Original Assignee: AT&T, Inc.
• Inventors: Sternheim, Marek A., van Gelder, Willem
• Primary Examiner(s): Powell, William A.
• Application Number:
  US06/412,271
• Time in Patent Office: 655 Days
• Field of Search: 156/626, 156/627, 156/643, 156/646, 156/654-659.1, 156/345, 204/164, 204/192 E, 204/298, 356/108, 356/114, 356/118, 356/355, 356/356, 356/357, 356/364, 356/368, 356/376, 356/378, 356/381, 356/382
• US Class Current: 216/60
• CPC Class Codes: G01B 11/06 for measuring thickness ; e.g. of sheet material thickness measurement by thermal means G01B21/085
• CPC Class Codes: G01B 11/22 for measuring depth

Abstract

A method and apparatus for measuring etch depth during the etching of a device pattern into a nontransparent substrate, is disclosed. The method makes use of the finding that the device patterns etched into substrates produce diffraction patterns when illuminated. Thus, according to the method, a beam of light is directed onto a region of a substrate, into which region a portion of a device pattern is being etched. The light reflected from this region forms a diffraction pattern and, according to the inventive method, the intensity of a diffraction order is detected and recorded as a function of time during the etching procedure. The intensity of the diffraction order varies with time. The etch rate of the substrate is inversely proportional to the period of the oscillations in the recorded intensity-time curve.

Claims

1. A method for fabricating a device, comprising the steps of:

etching a pattern into a substrate; and

monitoring said etching of said substrate by illuminating a region of said substrate with light and sensing a portion of the light reflected from said region, characterized in that

said region of said substrate is a region into which a portion of said pattern is being etched,

said sensing step includes the step of detecting the intensity of a diffraction order of the light reflected from said region, and

said method further comprises the step of terminating said etching based on the detected number of cycles of said intensity.

2. The method of claim 1 wherein said substrate includes a patterned etch mask.

3. The method of claim 1 wherein said diffraction order is the zeroth diffraction order.

4. The method of claim 1 wherein said etching is produced by plasma etching.

5. The method of claim 1 wherein said etching is produced by reactive ion etching.

6. The method of claim 1 wherein said etching is produced by ion milling.

7. The method of claim 1 wherein said etching is produced by wet chemical etching.

8. The method of claim 1 wherein said etching is produced by a directed beam of energy.

9. The method of claim 1 wherein said etching is produced by a directed beam of charged particles.

10. The method of claim 1 further comprising the steps of performing the steps necessary to complete the fabrication of said device.

11. A method for measuring the etch depth of a substrate during a process in which a device pattern is etched into said substrate, comprising the steps of:

illuminating a region of said substrate with light; and

sensing a portion of the light reflected from said region, characterized in that

said region of said substrate is a region into which a portion of said pattern is being etched,

said sensing step includes the step of detecting the intensity of a diffraction order of the light reflected from said region, and

said method further comprises the step of terminating said etching based on the detected number of cycles of said intensity.

12. The method of claim 11 wherein said substrate is covered by a patterned etch mask.

13. The method of claim 11 wherein said diffraction order is the zeroth diffraction.

14. Apparatus for measuring the etch rate of a substrate, during a process in which a device pattern is etched into said substrate, comprising:

first means for illuminating a region of said substrate with light; and

second means for sensing a portion of the light reflected from said region, characterized in that

said first means is adapted for directing light onto a region of said substrate into which a portion of said pattern is being etched,

said second means includes means for detecting the intensity of a diffraction order of the light reflected from said region, and

said etch rate is inversely proportional to a period of the variation with time of said intensity.