Method for positioning and fixing optical components relative to one another

• US 4,457,467 A
• Filed: 07/22/1982
• Issued: 07/03/1984
• Est. Priority Date: 09/25/1981
• Status: Expired due to Fees

• Current Assignee: Siemens AG
• Original Assignee: Siemens AG
• Inventors: Wittmann, Julius, Klement, Ekkehard
• Primary Examiner(s): Ramsey, Kenneth J.
• Application Number:
  US06/400,956
• Time in Patent Office: 712 Days
• Field of Search: 228/103, 228/105, 228/180 A, 228/188, 228/121, 228/123, 228/124, 228/212, 228/213
• US Class Current: 228/103
• CPC Class Codes: B23K 1/005 Soldering by means of radiant energy
• CPC Class Codes: G02B 6/3803 Adjustment or alignment devices for alignment prior to splicing
• CPC Class Codes: G02B 6/4238 Soldering
• CPC Class Codes: G02B 7/00 Mountings, adjusting means, or light-tight connections, for optical elements
• CPC Class Codes: H05K 2203/041 Solder preforms in the shape of solder balls
• CPC Class Codes: H05K 2203/107 Using laser light
• CPC Class Codes: H05K 3/3442 having edge contacts, e.g. leadless chip capacitors, chip carriers
• CPC Class Codes: H05K 3/3494 Heating methods for reflowing of solder using integral heating means H05K1/0212
• CPC Class Codes: Y02P 70/50 Manufacturing or production processes characterised by the final manufactured product

Abstract

A method for positioning and fixing optical components relative to one another which comprises the steps of providing a carrier plate having an optical component, securing an optical component on a retainer plate having at least one solderable area, positioning the retainer plate above the carrier plate with a reference mark on said plates being aligned and the solderable area on each of the two plates being disposed in aligned pairs of solderable areas, applying at least one solder piece to each pair of solderable areas as the plates are held in the position, melting the solder pieces, allowing the molten metal to solidify to secure the aligned plates together and then releasing the secured aligned plates.

Claims

1. A method for positioning and fixing optical components relative to one another, said method comprising the steps of providing a carrier plate having an optical component secured thereon and having at least one solderable area, providing a retaining plate having at least one solderable area, securing at least one optical component on said retaining plate, positioning the retaining plate above the carrier plate with a reference mark on each of said plates being aligned and the solderable area of the retaining plates being disposed in alignment with solderable areas on the carrier plate to form aligned pairs, while continuing to hold the plates in the aligned position applying at least one solder piece at each aligned pair of solderable areas, melting the solder pieces, allowing the molten solder to solidify to secure the aligned plates together and then releasing the holding of said plates.

2. A method according to claim 1, which includes providing a micromanipulator, said step of providing the retaining plate include providing a plate having means for fastening to a micromanipulator;

and said step of positioning the retaining plate above the carrier plate with a reference mark on each plate being aligned include utilizing the micromanipulator to position and hold the retaining plate over the carrier plate.

3. A method according to claim 1, wherein the method of providing a retaining plate and providing a carrier plate provides one of the plates consisting of material exhibiting poor thermal conductivity.

4. A method according to claim 1, wherein the step of providing the retaining plate and the step of providing the carrier plate provides at least one of the plates being composed of a non-metallic material, each plate of non-metallic material having solderable areas formed by a metallized layer.

5. A method according to claim 4, wherein the one plate is the retaining plate and the metallized layer is provided on the entire peripheral edge and on a surface adjacent said peripheral edge.

6. A method according to claim 4, wherein the non-metallic plate is the retaining plate and the metallized layer is provided on portions of the peripheral edge and a surface adjacent said portion of the peripheral edge.

7. A method according to claim 4, wherein the step of providing the metallized layers provides a gold layer.

8. A method according to claim 1, wherein the step of providing a retaining plate provides a plate consisting of a material selected from a group consisting of semiconductor material and ceramic materials, said plate being provided with metallized layers to form the solderable areas.

9. A method according to claim 1, wherein the step of providing a retaining plate provides a retaining plate having at least one groove for positioning the optical component to be secured thereon.

10. A method according to claim 9, wherein the retaining plate with at least one groove comprises providing a silicon plate and etching each groove therein.

11. A method according to claim 1, wherein the step of applying at least one solder piece provides solder pieces having a circular cross-section.

12. A method according to claim 1, wherein the method of providing solder pieces provides solder composed of an alloy having no significant change of volume upon solidification from the melted phase.

13. A method according to claim 1, wherein the step of melting the solder comprises applying electromagnetic radiation to melt said solder.

14. A method according to claim 13, wherein the step of applying electromagnetic radiation applies light energy.

15. A method according to claim 1, wherein the step of providing a carrier plate having an optical component secured thereon and securing an optical component on the retaining plate comprises selecting the optical components from a group consisting of semiconductor laser diodes, light-emitting diodes, microlenses, and light waveguides.