Multi-phase transistor/diode bridge circuit

• US 4,458,305 A
• Filed: 05/12/1982
• Issued: 07/03/1984
• Est. Priority Date: 05/12/1981
• Status: Expired due to Fees

• Current Assignee: Lucas Industries Public Limited Company Great King Street Birmingha B19 2XF England
• Original Assignee: Lucas Industries Limited (Zeppelin - Stiftung der Stadt Friedrichshafen)
• Inventors: Buckle, Allan S., Allso, Philip W.
• Primary Examiner(s): Beha, Jr., William H.
• Application Number:
  US06/377,422
• Time in Patent Office: 783 Days
• Field of Search: 363/123, 363/127, 363/132, 363/141, 363/144, 357/75, 357/81, 361/387, 361/388
• US Class Current: 363/141
• CPC Class Codes: H01L 2224/37147 Copper [Cu] as principal constituent
• CPC Class Codes: H01L 2224/40137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2224/40225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/43 Manufacturing methods
• CPC Class Codes: H01L 2224/43848 Thermal treatments, e.g. annealing, controlled cooling
• CPC Class Codes: H01L 2224/45147 Copper (Cu) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48472 the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
• CPC Class Codes: H01L 2224/49111 the connectors connecting two common bonding areas, e.g. Litz or braid wires
• CPC Class Codes: H01L 2224/73221 Strap and wire connectors
• CPC Class Codes: H01L 2224/73263 Layer and strap connectors
• CPC Class Codes: H01L 2224/84801 Soldering or alloying
• CPC Class Codes: H01L 24/37 of an individual strap connector
• CPC Class Codes: H01L 24/40 of an individual strap connector
• CPC Class Codes: H01L 24/45 of an individual wire connector
• CPC Class Codes: H01L 24/46 of a plurality of wire connectors
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/49 of a plurality of wire connectors
• CPC Class Codes: H01L 24/95 at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
• CPC Class Codes: H01L 25/072 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00011 : Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01005 : Boron [B]
• CPC Class Codes: H01L 2924/01006 : Carbon [C]
• CPC Class Codes: H01L 2924/01015 : Phosphorus [P]
• CPC Class Codes: H01L 2924/01028 : Nickel [Ni]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/01042 : Molybdenum [Mo]
• CPC Class Codes: H01L 2924/0105 : Tin [Sn]
• CPC Class Codes: H01L 2924/01083 : Bismuth [Bi]
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/1301 : Thyristor
• CPC Class Codes: H01L 2924/1305 : Bipolar Junction Transistor [BJT]
• CPC Class Codes: H01L 2924/1306 : Field-effect transistor [FET]
• CPC Class Codes: H02M 7/003 : Constructional details, e.g. physical layout, assembly, wiring or busbar connections

Abstract

A three-phase bridge circuit includes two sets of transistor/diode assemblies in which the diode of each assembly is connected in reverse current mode across the main current path of its transistor. Each diode of one set has its cathode connected to a positive d.c. input bus bar and its anode to a respective a.c. output bus bar. Each diode of the second set has its cathode connected to a negative d.c. input bus bar and a respective a.c. output bus bar. An input terminal has a plurality of electrical contacts, each connected to the control electrode of a respective transistor in the transistor/diode assemblies. A heat sink has its electrically insulating layer on one major surface thereof and in thermal contact therewith. Each transistor is in thermal contact with the heat sink by way of a bus bar part, and each of the bus bar parts is secured to the insulating layer so as to be in thermal contact with the heat sink.

Claims

1. A three-phase bridge arrangement including positive and negative d.c. input bus bars and first, second and third a.c. output bus bars, first and second sets of transistor/diode assemblies, each of said sets comprising three transistor/diode assemblies and each of said transistor/diode assemblies comprising a bipolar n-p-n transistor, and a diode which is electrically connected in reverse conduction mode across the current carrying zones of the transistor, each of the transistor/diode assemblies of said first set of assemblies having the cathode zone of its diode and the interconnected zone of its transistor electrically connected to said positive d.c. input bus bar and the anode zone of its diode and the interconnected zone of its transistor electrically connected to a respective one of said first, second and third a.c. output bus bars, each of said transistor/diode assemblies of said second set of assemblies having the anode zone of its diode and the interconnected zone of its transistor electrically connected to said negative d.c. input bus bar, and the cathode zone of its diode and the interconnected zone of its transistor electrically connected to a respective one of said first, second and third a.c. output bus bars, the bridge arrangement further including an input terminal having a plurality of electrical contacts each being electrically connected to the control zone of the transistor of a respective one of said transistor/diode assemblies, and a heat sink having an electrically insulating layer on one major surface thereof and in thermal contact therewith, the collector zone of each transistor of the first set of transistor/diode assemblies being in thermal contact with said heat sink by way of a respective one of three positive d.c. input bus bar extension pieces, which extension pieces are electrically connected with said positive d.c. input bus bar by way of respective flexible stranded connectors, the collector zone of each transistor of said second set of transistor/diode assemblies being in thermal contact with said heat sink by way of respective a.c. bus bar extension pieces each of which a.c. bus bar extension pieces is electrically connected with its respective first, second or third a.c. output bus bar by way of a respective flexible stranded connector, said electrical connection between said first, second and third a.c. output bus bars, and the respective anode and interconnected zones of the respective assemblies of the first set of transistor/diode assemblies being made by way of respective flexible stranded connectors, and, said electrical connections between said negative d.c. input bus bar and the anode and interconnected zones of the assemblies of the second set of transistor/diode assemblies being made by way of respective flexible stranded connectors.