Automatic mounting apparatus for chip components

• US 4,459,743 A
• Filed: 12/03/1981
• Issued: 07/17/1984
• Est. Priority Date: 12/05/1980
• Status: Expired due to Fees

• Current Assignee: Mamiya Camera Company Limited
• Original Assignee: Osawa Camera Sales Company Limited
• Inventors: Watanabe, Yoshitsugu, Koenuma, Katsutoshi
• Primary Examiner(s): Hall, Carl E.
• Application Number:
  US06/326,846
• Time in Patent Office: 957 Days
• Field of Search: 29/740, 29/759, 29/840, 29/741
• US Class Current: 29/740
• CPC Class Codes: H05K 13/028 Simultaneously loading a plurality of loose objects, e.g. by means of vibrations, pressure differences, magnetic fields
• CPC Class Codes: H05K 13/043 Feeding one by one by other means than belts
• CPC Class Codes: Y10T 29/49144 by metal fusion
• CPC Class Codes: Y10T 29/53178 Chip component
• CPC Class Codes: Y10T 29/53261 Means to align and advance work part

Abstract

An automatic mounting apparatus for electrical chip components comprises a parts feeder including a plurality of hoppers with the chip components therein, and a parts applicator including means for picking up the chip component and movable in orthogonal directions in programmed sequence to transport the chip components successively from the parts hopper to a printed circuit board for automatic mounting thereon within a minimum time.

Claims

1. An automatic mounting apparatus for mounting chip components on a printed circuit board, comprising a parts feeder including a plurality of exchangable parts hoppers which contain therein said chip components, a parts nest having a plurality of parts receivers connected through guide means to said hoppers for storing said chip components fed from said parts feeder in preparation for picking-up, a parts applicator including means for picking up said chip component and movable in orthogonal directions toward said parts receivers in programmed sequence, and means for transporting said printed circuit board to a position in proximity of said parts nest, said parts applicator being controlled in movement so that the chip components picked up from said parts receiver are moved to a predetermined position on said printed circuit board, and a common support frame for said parts feeder and said parts nest turnable about an axis from upright to fallen positions to remove the remaining chip components in said parts hoppers.

2. An automatic mounting apparatus according to claim 1, wherein said parts hoppers and guide means are inclined at an angle suitable for sliding said chip components down by gravitation.

3. An automatic mounting apparatus according to claim 1, further including means for vibrating said parts hoppers to mix said chip components in said parts hopper for alignment in direction with each other.

4. An automatic mounting apparatus according to claim 3, wherein each parts hopper has a circumferential edge with a toothed portion on said edge and a rack engaging said toothed portion, which reciprocable to impart the vertical and/or rotational movements to said parts hopper.

5. An automatic mounting apparatus according to claim 1, wherein said parts hoppers are shaped cylindrically with the bottom tapered conically and bored to receive said guide means.

6. An automatic mounting apparatus according to claim 5, wherein said parts hoppers are formed on an inner surface with a plurality of grooves for absorbing and collecting dusts and unwanted particles adhering to said chip components.

7. An automatic mounting apparatus according to claim 5, wherein said hopper is covered with a detachable cap carrying a holder for an identification card for designating the name of said chip components in said parts hopper.

8. An automatic mounting apparatus according to claim 5, wherein each parts hopper is provided at its bottom with a shutter which can close said parts hopper when said parts hopper is removed from said guide means.

9. An automatic mouting apparatus according to claim 7, wherein said cap is provided with a downwardly extending shaft which closes the entrance of said guide means.

10. An automatic mounting apparatus according to claim 1, wherein said guide means is a guide tube distorted at a certain angle between said part hopper and parts receiver.

11. An automatic mounting apparatus according to claim 10, wherein said guide tube is formed with a groove whose configuration is adapted to that of said chip component to be guided.

12. An automatic mounting apparatus according to claim 1, wherein said guide means is provided with a plurality of guide grooves spaced wider adjacent said parts hoppers and narrower adjacent said parts receiver.

13. An automatic mounting apparatus according to claim 1, wherein said guide means is made of one sheet of plate cut at its one end into a parallel guide elements which are staggered adjacent said parts hopper.

14. An automatic mounting apparatus according to claim 1, wherein said parts feeder includes a rotatable carrier having a plurality of arms equal in number to said parts receivers, and a plurality of gates each connected through said guide means to the corresponding one of said parts hopper, the arms of said carrier being rotated to reach one of said gates and take the chip component fed from the corresponding parts hopper for transportation to one of said parts receivers.