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Ultra-thin microelectronic pressure sensors

  • US 4,463,336 A
  • Filed: 06/24/1983
  • Issued: 07/31/1984
  • Est. Priority Date: 12/28/1981
  • Status: Expired due to Fees
First Claim
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1. A microelectronic device comprising:

  • a first silicon piece having an electronic device that has an electrical characteristic which varies with strain formed at a first surface thereof, said first piece being sufficiently thin to deflect in response to variations in ambient pressure sufficiently to provide a measurable variation in said electrical characteristic, access holes extending from a second surface of said first piece to said electronic device;

    electrical conductors extending from said electronic device outward through said access holes;

    a second silicon piece having a cavity formed at a first surface thereof;

    said first surfaces of said pieces facing each other with said device adjacent said cavity; and

    said pieces bonded together with borosilicate glass extending between said first surfaces except in the region of said device and said cavity.

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