Method and apparatus for demounting wafers

• US 4,466,852 A
• Filed: 10/27/1983
• Issued: 08/21/1984
• Est. Priority Date: 10/27/1983
• Status: Expired due to Term

• Current Assignee: AT&T Technologies Inc (Nokia Corporation)
• Original Assignee: AT&T Technologies Inc (Nokia Corporation)
• Inventors: Large, Donald M., Beltz, Richard K., Leffel, Daniel D.
• Primary Examiner(s): Dawson, Robert A.
• Application Number:
  US06/546,215
• Time in Patent Office: 299 Days
• Field of Search: 15/316 R, 15/317, 15/405, 29/426.1, 29/426.4, 134/59, 156/344, 156/584, 156/155, 269/903
• US Class Current: 156/701
• CPC Class Codes: B24B 37/345 Feeding, loading or unloading work specially adapted to lapping
• CPC Class Codes: Y10S 134/902 Semiconductor wafer
• CPC Class Codes: Y10S 156/93 Semiconductive product delaminating, e.g. delaminating emiconductive wafer from underlayer
• CPC Class Codes: Y10T 156/11 Methods of delaminating, per se; i.e. , separating at bonding face
• CPC Class Codes: Y10T 156/19 Delaminating means
• CPC Class Codes: Y10T 29/49821 by altering or destroying work part or connector

Abstract

Wafers (12), including those in the solid state electronics industry, are demounted from an adherent surface (79). A respective passageway (90) is extended from a fluid supply device (92), through the adherent surface (79) to and in communication with, the mounting surface (16) of a respective wafer (12). The fluid is applied via the passageway (90) to and between the mounting surface (16) of the wafer (12) and the adherent surface (79) with sufficient pressure to dislodge the wafer (12). In an advantageous embodiment, the passageway (90) extends to a location between about the centerline (98) and the periphery of the wafer (12). The fluid is thereby applied in an off-center manner with leveraged force to break the seal between the adherent surface (79) and the wafer (12).

Claims

1. A method of demounting a wafer from an adherent surface, comprising:

applying, via a passageway through the adherent surface, to and between the adherent surface and a mounting surface of the wafer, a fluid with sufficient pressure to dislodge the wafer; and

removing the dislodged wafer from the adherent surface.

2. A method of demounting a wafer from an adherent surface, comprising:

extending a passageway from fluid supply means, through the adherent surface to and in communication with, a mounting surface of the wafer; and

applying fluid via a passsageway through the adherent surface to and between the mounting surface of the wafer and the adherent surface with sufficient pressure to dislodge the wafer from the adherent surface.

3. A method as in claim 2 wherein the adherent surface is provided on a compressible pad on a wafer carrier further comprising:

extending the passageway through the pad to the mounting surface of the wafer.

4. A method as in claim 3 wherein the step of extending the passageway further includes:

extending the passageway through the adherent surface at a location between about the center and the periphery of the mounting surface of a wafer such that the fluid is initially applied off-center of the wafer.

5. A method as in claim 4 wherein the applying step further comprises:

applying a liquid with sufficient pressure to dislodge the wafer but with insufficient pressure to fully disengage the wafer from the carrier such that the wafer rides upon a liquid film on a surface and is readily removed therefrom.

6. A method as in claim 5 wherein the applying step further comprises:

applying the liquid with supply means including a nozzle which penetrates through the passageway a distance sufficient to push the wafer off the liquid film; and

extending said nozzle through the passageway and against the wafer a distance sufficient to push the wafer off the liquid film and off the carrier.

7. A method as in claim 4 wherein the fluid applied via the passageway is water.

8. A method as in claim 4 wherein the fluid applied via the passageway is air.

9. Apparatus for demounting a wafer from an adherent surface comprising:

a passageway extending from fluid supply means, through the adherent surface to and in communication with a mounting surface of the wafer; and

means for applying the fluid via the passageway to and between the mounting surface of the wafer and the adherent surface with sufficient pressure to dislodge the wafer from the adherent surface.

10. Apparatus as in claim 9 wherein the adherent surface is on a wafer carrier and is provided by the surface of an at least partially compressible pad further comprising:

the passageway extending through the pad to the mounting surface of the wafer.

11. Apparatus as in claim 10 wherein the passageway further includes:

the passageway extending through the adherent surface at a location between about the center and the periphery of the mounting surface of a wafer such that the fluid is initially applied off-center of the wafer in a leveraged manner.

12. Apparatus as in claim 11 wherein the means for applying the fluid further comprises:

means for applying a liquid with sufficient pressure to dislodge the wafer but with insufficient pressure to fully disengage the wafer from the carrier such that the wafer rides upon a liquid film on the adherent surface and is readily removed therefrom.

13. Apparatus as in claim 12 wherein the means for applying the liquid further comprises:

a nozzle which penetrates through the passageway a distance sufficient to push the wafer off the liquid film; and

means for extending said nozzle through the passageway and against the wafer a distance sufficient to push the wafer off the liquid film and off the carrier.

14. Apparatus as in claim 11 wherein the fluid applied via the passageway is water.

15. Apparatus as in claim 11 wherein the fluid applied via the passageway is air.