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Method and apparatus for demounting wafers

  • US 4,466,852 A
  • Filed: 10/27/1983
  • Issued: 08/21/1984
  • Est. Priority Date: 10/27/1983
  • Status: Expired due to Term
First Claim
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1. A method of demounting a wafer from an adherent surface, comprising:

  • applying, via a passageway through the adherent surface, to and between the adherent surface and a mounting surface of the wafer, a fluid with sufficient pressure to dislodge the wafer; and

    removing the dislodged wafer from the adherent surface.

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  • 2 Assignments
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