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Magnetron cathode sputtering apparatus

  • US 4,466,877 A
  • Filed: 10/11/1983
  • Issued: 08/21/1984
  • Est. Priority Date: 10/11/1983
  • Status: Expired due to Term
First Claim
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1. Magnetron cathode sputtering apparatus, comprising a pair of elongated rotatable sputtering targets mounted in horizontally spaced parallel relation in an evacuable coating chamber for sputter-coating substrates also located in said chamber beneath said targets, and separate magnetic means located in said targets, said magnetic means being disposed at an angle to one another to focus the material sputtered from said targets upon said substrates.

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