Transducer apparatus employing convoluted semiconductor diaphragms
First Claim
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1. A pressure transducer, comprising:
- a convoluted semiconductor diaphragm member having a central portion manifesting a plurality of concentric recesses forming a series of convolutions and an outer nondeflecting peripheral areaat least one semiconductor sensor deposited on said diaphragm within said peripheral area with a portion of said sensor being located proximate to an edge of an outer convolution.
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Abstract
A pressure transducer employing a semiconductor diaphragm having a convoluted central section surrounded by a rigid peripheral section. The convolutions are a series of concentric grooves formed as squares producing a square nonplanar diaphragm in the preferred embodiment. The convolutions are formed on the semiconductor wafer by an anisotropic etch. Piezoresistive devices are diffused into the diaphragm in the peripheral region to form a bridge array. The transducer structure thus formed is capable of producing a linear and large magnitude voltage signal in response to a relatively small applied pressure or force.
41 Citations
10 Claims
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1. A pressure transducer, comprising:
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a convoluted semiconductor diaphragm member having a central portion manifesting a plurality of concentric recesses forming a series of convolutions and an outer nondeflecting peripheral area at least one semiconductor sensor deposited on said diaphragm within said peripheral area with a portion of said sensor being located proximate to an edge of an outer convolution. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A pressure transducer comprising:
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a convoluted semiconductor diaphragm of a relatively square shaped configuration having a central area manifesting a series of concentric square shaped convolutions with an outer nondeflecting peripheral area first and second piezoresistive sensors deposited on said diaphragm within said peripheral area and located on opposite sides along the same first axis and operative to respond to mainly transverse stress, third and fourth piezoresistive sensors deposited on said diaphragm within said peripheral area and located on opposite sides of a second axis, perpendicular to said first axis and operative to respond to mainly longitudinal stress. - View Dependent Claims (9, 10)
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Specification