Method of making aluminum gate self-aligned FET by selective beam annealing through reflective and antireflective coatings

• US 4,468,855 A
• Filed: 08/04/1982
• Issued: 09/04/1984
• Est. Priority Date: 08/05/1981
• Status: Expired due to Term

• Current Assignee: Fujitsu Limited
• Original Assignee: Fujitsu Limited
• Inventors: Sasaki, Nobuo
• Primary Examiner(s): Roy, Upendra
• Application Number:
  US06/405,269
• Time in Patent Office: 762 Days
• Field of Search: 148/1.5, 29/576 B, 29/571, 29/576 T, 357/91, 427/53.1
• US Class Current: 438/301
• CPC Class Codes: H01L 21/2636 for heating, e.g. electron beam heating
• CPC Class Codes: H01L 21/268 using electromagnetic radiation, e.g. laser radiation
• CPC Class Codes: H01L 21/28008 Making conductor-insulator-semiconductor electrodes
• CPC Class Codes: H01L 29/66575 where the source and drain or source and drain extensions are self-aligned to the sides of the gate H01L29/66606 takes precedence
• CPC Class Codes: H01L 29/78 with field effect produced by an insulated gate H01L29/7725, H01L29/775, H01L29/778 take precedence
• CPC Class Codes: Y10S 148/09 Laser anneal
• CPC Class Codes: Y10S 148/091 Laser beam processing of fets
• CPC Class Codes: Y10S 148/106 Masks, special
• CPC Class Codes: Y10S 148/141 Self-alignment coat gate

Abstract

A method for producing a semiconductor device comprising the steps of forming a gate insulating layer (3) on a semiconductor substrate having a first conductivity (1) and forming an aluminum gate electrode (4) on the gate insulating layer (3); impurity doped regions (5, 6) are then formed in the semiconductor substrate (1) by means of implantation of impurity ions having a second conductivity opposite that of the first conductivity into the semiconductor substrate (1) using the aluminum gate electrode (4) as a masking material for annealing the impurity doped regions (5, 6). The annealing process occurs by irradiating a beam on the impurity doped regions (5, 6) including the aluminum gate electrode (4). After forming the impurity doped regions (5, 6) in the semiconductor substrate (1), at least the upper surface of the aluminum gate electrode (4) is covered with an insulating layer (7).

Claims

1. A method for producing a semiconductor device formed on a semiconductor substrate of a first conductivity type, comprising the steps of:

(a) forming a gate insulating layer on the semiconductor substrate;

(b) forming an aluminum gate electrode on the gate insulating layer;

(c) forming an impurity doped region in the semiconductor substrate by doping the semiconductor substrate with an impurity having a second conductivity type opposite that of the first conductivity type, using the aluminum gate electrode as a masking material;

(d) covering at least the upper surface of the aluminum gate electrode with an insulating layer; and

(e) annealing the impurity doped region by irradiating a beam on the impurity doped region and the aluminum gate electrode.

2. A method according to claim 1, wherein said forming step a comprises forming the gate insulating layer having a thickness t equal to the value calculated by the formula λ

(2m-1)/4n, wherein n is the index of refraction of the gate insulating layer, λ

is the beam wavelength in a vacuum, and m is a positive integer.

3. A method according to claim 1, wherein said covering step d comprises covering the aluminum gate electrode with the insulating layer having a thickness t equal to the value calculated by the formula λ

m/2n, wherein n is the index of refraction of the insulating layer, λ

is the beam wavelength in a vacuum, and m is a positive integer.

4. A method according to claim 1, 2 or 3, wherein the beam in said annealing step e is selected from the group consisting of a laser beam, an electron beam, and a lamp beam.

5. A method according to claim 1, 2 or 3, wherein said covering step d comprises covering the aluminum layer with the insulating layer which comprises aluminum oxide.

6. A method according to claim 1, 2 or 3, wherein said covering step d comprises covering the aluminum layer with the insulating layer which comprises silicon nitride.

7. A method according to claim 1, 2 or 3, wherein said covering step d comprises covering the aluminum layer with the insulating layer which comprises silicon dioxide.

8. A method according to claim 4, wherein said covering step d comprises covering the aluminum layer with the insulating layer which comprises aluminum oxide.

9. A method according to claim 4, wherein said covering step d comprises covering the aluminum layer with the insulating layer which comprises silicon nitride.

10. A method according to claim 4, wherein said covering step d comprises covering the aluminum layer with the insulating layer which comprises silicon dioxide.