Roofing tile with thermal conduction device

• US 4,470,406 A
• Filed: 05/14/1981
• Issued: 09/11/1984
• Est. Priority Date: 05/14/1981
• Status: Expired due to Fees

• Current Assignee: Redland ROOF Tiles Limited
• Original Assignee: Redland ROOF Tiles Limited
• Inventors: Rinklake, Manfred, Roettger, Wilhelm, Zeibig, Josef, Joest, Guenter
• Primary Examiner(s): O'Connor, Daniel J.
• Application Number:
  US06/263,606
• Time in Patent Office: 1,216 Days
• Field of Search: 126/DIG. 2, 126/442, 126/446, 126/447, 126/448, 126/449, 126/450
• US Class Current: 126/622
• CPC Class Codes: E04D 1/2916 the fastening means taking hold directly on adjacent elements of the same row
• CPC Class Codes: E04D 1/30 Special roof-covering elements, e.g. ridge tiles, gutter tiles, gable tiles, ventilation tiles E04D3/40 takes precedence
• CPC Class Codes: E04D 2001/308 for special purposes not otherwise provided for, e.g. turfing tiles, step tiles
• CPC Class Codes: F24S 20/69 in the form of shingles or tiles
• CPC Class Codes: Y02B 10/20 Solar thermal
• CPC Class Codes: Y02E 10/40 Solar thermal energy, e.g. solar towers
• CPC Class Codes: Y02E 10/44 Heat exchange systems

Abstract

A concrete roofing tile (10) has a thermal conduction device in the form of metal sheets (20a, 20b) attached to its underside. Planar metal contacts (30a, 30b) project from the underside of the sheets and are adapted to clip on a pipe (40) which extends up the roof and carries a heat carrier medium. The pipe is part of grid fixed to a roof structure for collecting heat absorbed by the tiles. The tiles have the appearance of ordinary roofing tiles from the outside.

Claims

1. A roofing tile comprising a tile body and a thermal conduction device on the underside, in use, of the tile body in which the thermal conduction device, comprises thermal conduction sheets including partly stamped out and bent up anchoring sections and edge portions which are embedded into the tile body for securing the sheets to the underside of the tile body, the sheets including on one longitudinal side beads of quadrant shape from which two generally planar sheet-metal contact strips protrude facing each other and extending downwards away from the tile body, the contact strips extending basically over the whole length of the tile body and being generally trapezoidal with the longer of the two parallel sides adjacent a tail area of the tile and with the ends of the contacts facing the tail area of the tile being set back from the corresponding edges of the thermal conduction sheets, lower corner areas of the contact strips adjacent to a head area of the tile being bent outward and the contact strips being resiliently splayable for the purpose of slipping them onto a heat carrier medium pipe so that, in use, the contact strips engage both sides of the heat carrier medium pipe which is fixed to the roof structure for transferring heat to the pipe.