Flow sensor
First Claim
Patent Images
1. A flow sensor, comprising:
- a thin film heater;
a pair of thin film sensors;
a semiconductor body with a depression therein;
andmeans connecting the heater and the sensors to the body and bridging the depression so that at least a major portion of the heater and the sensors are out of contact with the body and with the sensors disposed on opposite sides of the heater, the means connecting comprising two thin film members bridging the depression, each member comprising one sensor and a portion of the heater.
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Abstract
A flow sensor comprising a pair of thin film heat sensors and a thin film heater is disclosed. The flow sensor further comprises a semiconductor body with a depression therein and structure connecting the heater and the sensors to the body and bridging the depression so that at least a major portion of the heater and the sensors are out of contact with the body. The sensors are disposed on opposite sides of the heater, the structure connecting comprising two thin film members bridging the depression, each member comprising one sensor and a portion of the heater.
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Citations
15 Claims
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1. A flow sensor, comprising:
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a thin film heater; a pair of thin film sensors; a semiconductor body with a depression therein; and means connecting the heater and the sensors to the body and bridging the depression so that at least a major portion of the heater and the sensors are out of contact with the body and with the sensors disposed on opposite sides of the heater, the means connecting comprising two thin film members bridging the depression, each member comprising one sensor and a portion of the heater. - View Dependent Claims (4, 5, 6, 7, 8, 9, 14, 15)
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2. A flow sensor comprising:
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a thin film heater encapsulated in thin film dielectric; a pair of thin film sensors encapsulated in thin film dielectric, the sensors being disposed on opposite sides of the heater; a semiconductor body with a depression therein; and the encapsulated heater and sensors forming two thin film members bridged across the depression so that at least a major portion of the heater and the sensors are out of contact with the semiconductor body, each member comprising one sensor and a portion of the heater. - View Dependent Claims (10, 11, 12, 13)
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3. A flow sensor comprising:
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a semiconductor body having a depression formed into a first surface of the body; a thin film heater encapsulated in thin film dielectric; and a pair of thin film sensors encapsulated in thin film dielectric, the thin film sensors being disposed on opposite sides of the heater; the encapsulated heater and sensors forming two thin film members, the two thin film members being attached to the first surface at least at one location in order to suspend at least a major portion of the heater and sensors over the depression, each member comprising one sensor and a portion of the heater.
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Specification