Method of and device for positioning electrical and/or electronic components on a substrate
First Claim
1. A method of positioning components on a substrate, in which a number of parts are simultaneously transferred from a pick-up position to a mounting position so as to be positioned on the substrate, characterized by comprisingpresenting a plurality of components in a first geometric pattern having a regular pitch,picking up said plurality of components, in said first geometric pattern,simultaneously moving said plurality of components along a first path segment from the pick-up position toward respective mounting positions,then changing the relative positions of the components to at least a second, different geometric pattern, andpositioning said components on a substrate in a geometric pattern different from said first pattern.
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Accused Products
Abstract
For the mounting of electrical and/or electronic components on a substrate, the components are presented in a pick-up position in a fixed, invariable pattern, preferably in a straight row. The components are simultaneously picked up in this pattern by a number of transfer devices and simultaneously moved toward their mounting positions over the substrate. During this transfer, they are moved different distances into a modified pattern with respect to one another, which corresponds to the desired pattern in which the components are to be positioned on the substrate. The transfer devices are programmed by means of exchangeable program plates.
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Citations
29 Claims
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1. A method of positioning components on a substrate, in which a number of parts are simultaneously transferred from a pick-up position to a mounting position so as to be positioned on the substrate, characterized by comprising
presenting a plurality of components in a first geometric pattern having a regular pitch, picking up said plurality of components, in said first geometric pattern, simultaneously moving said plurality of components along a first path segment from the pick-up position toward respective mounting positions, then changing the relative positions of the components to at least a second, different geometric pattern, and positioning said components on a substrate in a geometric pattern different from said first pattern.
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13. A device for placing a plurality of components simultaneously on a substrate, means for supplying a plurality of components at a pick-up position, arranged in a first geometric pattern;
- and a transfer mechanism for moving said components simultaneously and mounting the components against a substrate on said carrier, characterized in that said transfer mechanism comprises
a guide, a plurality of transfer arms, each slidably mounted in said guide, each arm further comprising a pick-up element for a component, common drive means for moving the transfer arms in said guide between the pick-up and mounting positions, first abutment means for defining the pick-up position for the pick-up arms, and second abutment means for defining the respective mounting positions for individual pick-up arms. - View Dependent Claims (14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28)
- and a transfer mechanism for moving said components simultaneously and mounting the components against a substrate on said carrier, characterized in that said transfer mechanism comprises
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29. an elongate arm comprising a plurality of stamps,
means for displacing said arm between a rest position, and an operating position in which the stamps contact lower sides of the components, and means for applying a quantity of fixing medium to the stamps in the rest position.
Specification