Temperature control of solid state circuit chips

• US 4,481,403 A
• Filed: 03/04/1983
• Issued: 11/06/1984
• Est. Priority Date: 03/04/1983
• Status: Expired due to Fees

• Current Assignee: Honeywell Incorporated (Honeywell International Inc.)
• Original Assignee: Honeywell Incorporated (Honeywell International Inc.)
• Inventors: Del Monte, Lou A.
• Primary Examiner(s): Albritton, C. L.
• Assistant Examiner(s): Walberg, Teresa J.
• Application Number:
  US06/471,986
• Time in Patent Office: 613 Days
• Field of Search: 219/209, 219/501, 219/508, 219/499, 361/400, 361/403, 29/840, 357/68, 357/69, 357/28, 307/310
• US Class Current: 219/209
• CPC Class Codes: B23K 1/0004 Resistance soldering
• CPC Class Codes: H01L 2224/13099 Material
• CPC Class Codes: H01L 2224/131 with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
• CPC Class Codes: H01L 2224/81234 using means for applying energy being within the device, e.g. integrated heater
• CPC Class Codes: H01L 23/345 Arrangements for heating thermal treatment apparatus H01L21/00
• CPC Class Codes: H01L 23/498 Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers shape of the substrate H01L23/13
• CPC Class Codes: H01L 23/49816 Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
• CPC Class Codes: H01L 23/49822 Multilayer substrates multilayer metallisation on monolayer substrate H01L23/498
• CPC Class Codes: H01L 24/16 of an individual bump connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0001 Technical content checked by a classifier
• CPC Class Codes: H01L 2924/01037 Rubidium [Rb]
• CPC Class Codes: H01L 2924/014 Solder alloys
• CPC Class Codes: H01L 2924/10253 Silicon [Si]
• CPC Class Codes: H01L 2924/351 Thermal stress

Abstract

Controlled heater apparatus for selectively heating a solid state circuit chip and the substrate upon which it is mounted by a solder bump so as to cause substantially equal expansion and contraction in the chip and substrate to relieve stress on the connecting solder bump.

Claims

1. Apparatus for use with first and second components joined by connection means to relieve the stress in the connection means due to temperature effects which cause different expansions and contracts between the first and second components comprising:

first heater means proximate the first component;

energizing means connected to said first heater means;

temperature sensing means proximate the first and second components to sense the temperatures thereof; and

control means connected to said temperature sensing means and to said energizing means and operable in accordance with a first predetermined temperature relationship between the first and second components to energize the said first heater means to heat the first component to an extent sufficient to offset the difference in expansion and contraction of the components.

2. Apparatus according to claim 1 including second heater means connected to said energizing means and proximate the second component, said control means operable in accordance with a second predetermined temperature relationship to energize the second heater means to heat the second component to an extent sufficient to offset the difference in expansion and contraction of the components.

3. Apparatus according to claim 1 wherein the first component is a solid state electronic chip, the second component is a substrate and the connection means includes a solder bump.

4. Apparatus according to claim 2 wherein the first component is a solid state electronic chip, the second component is a substrate and the connection means includes a solder bump.

5. Apparatus according to claim 3 wherein the first heater means is a resistor deposited on the chip.

6. Apparatus according to claim 4 wherein the first heater means is a resistor deposited on the chip and the second heater means is a resistor deposited on the substrate.

7. Apparatus according to claim 4 wherein the temperature sensing means includes a first temperature sensitive resistor deposited on the chip and a second temperature sensitive resistor deposited on the substrate.

8. Apparatus according to claim 7 wherein the control means includes means for comparing the values of the first and second temperature sensitive resistors and to energize the first and second heaters in accordance with the comparison.

9. Apparatus according to claim 2 wherein the control means is characterized to energize the first and second heater means in accordance with the coefficients of thermal expansion of the first and second components.